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Microelectronic packages having hermetic cavities and methods for the production thereof

  • US 10,442,685 B2
  • Filed: 03/31/2014
  • Issued: 10/15/2019
  • Est. Priority Date: 03/31/2014
  • Status: Active Grant
First Claim
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1. A microelectronic package, comprising:

  • first and second Microelectromechanical Systems (MEMS) transducer structures formed on a sensor die and enclosed within first and second cavities, respectively;

    a first cap piece bonded to the sensor die to seal the first cavity at a first predetermined pressure;

    a vent hole fluidly coupled to the second cavity;

    a second cap piece bonded to the first cap piece opposite the sensor die, covering the vent hole, and sealing the second cavity at a second predetermined pressure different than the first predetermined pressure; and

    an Application Specific Integrated Circuit (ASIC) formed on the second cap piece and fluidly coupled to the second cavity through the vent hole.

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