Method of forming hole in glass substrate by using pulsed laser, and method of producing glass substrate provided with hole

• US 10,442,720 B2
• Filed: 09/27/2016
• Issued: 10/15/2019
• Est. Priority Date: 10/01/2015
• Status: Active Grant

• Current Assignee: AGC, Inc.
• Original Assignee: AGC, Inc.
• Inventors: Horiuchi, Kohei, Ono, Motoshi
• Primary Examiner(s): Franklin, Jodi C
• Application Number:
  US15/276,990
• Publication Number:
  US 20170096361A1
• Time in Patent Office: 1,113 Days
• CPC Class Codes: B23K 2103/54 Glass
• CPC Class Codes: B23K 26/0622 by shaping pulses
• CPC Class Codes: B23K 26/073 Shaping the laser spot
• CPC Class Codes: B23K 26/382 by boring
• CPC Class Codes: B23K 26/402 involving non-metallic material, e.g. isolators
• CPC Class Codes: C03B 33/082 using a focussed radiation beam, e.g. laser C03B33/0855 takes precedence

Abstract

Disclosed is a method of forming a hole in a glass substrate by using a pulsed laser, the method including (1) preparing the glass substrate including a first surface and a second surface that face each other; (2) forming a concave portion on the first surface by irradiating, with a first condition, the pulsed laser onto the first surface of the glass substrate through a lens; and (3) forming the hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate.

Claims

1. A method of forming a hole in a glass substrate, comprising:

preparing a glass substrate having a first surface and a second surface that face each other;

forming a concave portion on the first surface of the glass substrate by irradiating, with a first condition, a pulsed laser onto the first surface of the glass substrate through a lens such that the concave portion on the first surface of the glass substrate has a diameter ϕ and

a depth d, the diameter ϕ

is greater than or equal to a diameter S (ϕ

≥

S) of a spot on the first surface of the glass substrate formed by the pulsed laser, the diameter S is expressed by a formula (i), S=(4×

λ

×

f×

M²)/(π

×

r), where λ

is a wavelength of the pulsed laser, f is a focal length of the lens, M² is an M-squared value, and r is a diameter of a beam of the pulsed laser entering the lens, and the depth d is greater than or equal to 0.7 times the diameter ϕ

; and

forming a hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate,

wherein the first condition is such that the energy density of the pulsed laser is selected to exceed the processing threshold value of the glass substrate.

2. The method according to claim 1, further comprising:

forming an absorber layer on the first surface of the glass substrate.

3. The method according to claim 1, wherein a pulse train of the pulsed laser in the second condition is modulated.

4. The method according to claim 3, further comprising:

forming an absorber layer on the first surface of the glass substrate.

5. The method according to claim 3, wherein the wavelength λ

of the pulsed laser is less than or equal to 1200 nm.

6. The method according to claim 3, wherein the diameter ϕ

is in a range from 3 μ

m to 30 μ

m.

7. The method according to claim 3, wherein the depth d is in a range from 2.1 μ

m to 120 μ

m.

8. The method according to claim 3, wherein the diameter S of the spot is less than or equal to 15 μ

m.

9. The method according to claim 1, wherein the wavelength λ

of the pulsed laser is less than or equal to 1200 nm.

10. The method according to claim 1, wherein the diameter ϕ

is in a range from 3 μ

m to 30 μ

m.

11. The method according to claim 1, wherein the depth d is in a range from 2.1 μ

m to 120 μ

m.

12. The method according to claim 1, wherein the diameter S of the spot is less than or equal to 15 μ

m.

13. The method according to claim 1, wherein the wavelength λ

of the pulsed laser is less than or equal to 1200 nm, the diameter ϕ

is in a range from 3 μ

m to 30 μ

m, the depth d is in a range from 2.1 μ

m to 120 μ

m, and the diameter S of the spot is less than or equal to 15 μ

m.

14. A method of producing a glass substrate with a hole, comprising:

preparing the glass substrate having a first surface and a second surface that face each other;

forming a concave portion on the first surface of the glass substrate by irradiating, with a first condition, a pulsed laser onto the first surface of the glass substrate through a lens such that the concave portion on the first surface of the glass substrate has a diameter ϕ and

a depth d, the diameter ϕ

is greater than or equal to a diameter S (ϕ

≥

S) of a spot on the first surface formed by the pulsed laser, the diameter S is expressed by a formula (i), S=(4×

λ

×

f×

M²)/(π

×

r), where λ

is a wavelength of the pulsed laser, f is a focal length of the lens, M² is an M-squared value, and r is a diameter of a beam of the pulsed laser entering the lens, and the depth d is greater than or equal to 0.7 times the diameter ϕ

; and

forming a hole by irradiating the pulsed laser onto the concave portion with a second condition such that energy density of the pulsed laser is less than or equal to a processing threshold value of the glass substrate,

wherein the first condition is such that the energy density of the pulsed laser is selected to exceed the processing threshold value of the glass substrate.

15. The method according to claim 14, further comprising:

forming an absorber layer on the first surface of the glass substrate.

16. The method according to claim 14, wherein a pulse train of the pulsed laser in the second condition is modulated.

17. The method according to claim 14, wherein the wavelength A of the pulsed laser is less than or equal to 1200 nm.

18. The method according to claim 14, wherein the diameter ϕ

is in a range from 3 μ

m to 30 μ

m.

19. The method according to claim 14, wherein the depth d is in a range from 2.1 μ

m to 120 μ

m.

20. The method according to claim 14, wherein the diameter S of the spot is less than or equal to 15 μ

m.