Galvanic signal path isolation in an encapsulated package using a photonic structure
First Claim
Patent Images
1. A device, comprising:
- a first integrated circuit (IC) die having an electromagnetic transmitter circuit, the electromagnetic transmitter circuit having an output configured to emit an electromagnetic signal;
a second IC die having an electromagnetic receiver circuit, the electromagnetic receiver circuit having an input configured to receive the electromagnetic signal, the second IC die spaced apart from the first IC die;
a leadframe having first and second die attach pads, the first die attach pad separated from the second die attach pad;
a photonic structure including a photonic waveguide coupled between the output of the electromagnetic transmitter circuit and the input of the electromagnetic receiver circuit, a portion of the photonic structure being located between the first IC die and the first die attach pad; and
an encapsulation material encapsulating the first IC die, the second IC die and the photonic waveguide.
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Abstract
An encapsulated package is provided that includes a pair integrated circuit (IC) die. A radio frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a selected frequency. An RF circuit on the other IC die is operable to receive the RF signal Encapsulation material encapsulates the IC die. A photonic waveguide couples between the RF transmitter and RF receiver to form galvanic path isolation between the two IC die. The photonic waveguide is formed by a photonic structure within the encapsulation material.
64 Citations
18 Claims
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1. A device, comprising:
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a first integrated circuit (IC) die having an electromagnetic transmitter circuit, the electromagnetic transmitter circuit having an output configured to emit an electromagnetic signal; a second IC die having an electromagnetic receiver circuit, the electromagnetic receiver circuit having an input configured to receive the electromagnetic signal, the second IC die spaced apart from the first IC die; a leadframe having first and second die attach pads, the first die attach pad separated from the second die attach pad; a photonic structure including a photonic waveguide coupled between the output of the electromagnetic transmitter circuit and the input of the electromagnetic receiver circuit, a portion of the photonic structure being located between the first IC die and the first die attach pad; and an encapsulation material encapsulating the first IC die, the second IC die and the photonic waveguide. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method, comprising:
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forming a photonic structure including a photonic waveguide; through a portion of the photonic structure, attaching a first integrated circuit (IC) die having an electromagnetic transmitter to a first die attach pad of a leadframe, the portion of the photonic structure being located between the first IC die and the first die attach pad; attaching a second IC die having an electromagnetic receiver to a second die attach pad of the leadframe, in which the first die attach pad is separated from the second die attach pad, the first IC die is spaced apart from the second IC die, and the photonic waveguide is coupled between an output of the electromagnetic transmitter and an input of the electromagnetic receiver; and with an encapsulation material, encapsulating the first IC die, the second IC die and the photonic waveguide. - View Dependent Claims (16, 17, 18)
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Specification