Fingerprint sensing assemblies and methods of making

• US 10,445,548 B2
• Filed: 02/13/2017
• Issued: 10/15/2019
• Est. Priority Date: 10/04/2004
• Status: Active Grant

• Current Assignee: Synaptics Incorporated
• Original Assignee: Synaptics Incorporated
• Inventors: Benkley, III, Fred G.
• Primary Examiner(s): Seth, Manav
• Application Number:
  US15/430,831
• Publication Number:
  US 20170154200A1
• Time in Patent Office: 974 Days
• CPC Class Codes: G06V 40/1306 non-optical, e.g. ultrasonic or capacitive sensing
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: G06V 40/1359 Extracting features related to ridge properties; Determining the fingerprint type, e.g. whorl or loop
• CPC Class Codes: G06V 40/1376 Matching features related to ridge properties or fingerprint texture
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A fingerprint sensing module includes a sensor substrate having a sensing side and a circuit side, an image sensor including conductive traces on the circuit side of the sensor substrate, and a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor. The sensor substrate may be a flexible substrate. The module may include a velocity sensor on the sensor substrate or on a separate substrate. The module may further include a rigid substrate, and the sensor substrate may be affixed to the rigid substrate.

Claims

1. A fingerprint sensing module, comprising:

a sensor substrate having a circuit side;

an image sensor including conductive traces on the circuit side of the sensor substrate, the conductive traces comprising;

at least one image pickup plate, and

at least one image drive plate in spaced relation to the at least one image pickup plate to define at least one sensor gap between the at least one image drive plate and the at least one image pickup plate, wherein ridge peaks and ridge valleys of a fingerprint over the at least one sensor gap produce a change in capacitance between the at least one image drive plate and the at least one image pickup plate;

a sensor circuit including at least one integrated circuit mounted on the circuit side of the sensor substrate and electrically connected to the image sensor; and

a rigid substrate, wherein the sensor substrate is affixed to a first surface of the rigid substrate, wherein the sensor substrate has a larger area than the rigid substrate.

2. The fingerprint sensing module as defined in claim 1, further comprising:

a velocity sensor, wherein the velocity sensor is electrically connected to the sensor circuit.

3. The fingerprint sensing module as defined in claim 1, wherein the circuit side of the sensor substrate is affixed to the first surface of the rigid substrate with an adhesive.

4. The fingerprint sensing module as defined in claim 1, wherein a first section of the sensor substrate is affixed to the first surface of the rigid substrate with an adhesive and a second section of the sensor substrate is attachable to another device.

5. The fingerprint sensing module as defined in claim 1, wherein the rigid substrate includes a cutout for receiving the at least one integrated circuit.

6. The fingerprint sensing module as defined in claim 1, further comprising:

one or more circuit components mounted on a second surface of the rigid substrate, wherein the one or more circuit components are connected to the sensor circuit.

7. The fingerprint sensing module as defined in claim 1, wherein the sensor substrate and the rigid substrate are electrically connected by conductive adhesive between conductive interconnect pads on the sensor substrate and the rigid substrate.

8. The fingerprint sensing module as defined in claim 1, wherein the sensor substrate is affixed to at least two surfaces of the rigid substrate.

9. The fingerprint sensing module as defined in claim 1, further comprising:

a base for mounting of the sensor substrate and the rigid substrate.

10. The fingerprint sensing module as defined in claim 9, wherein the base has a curved surface for mounting of the sensor substrate.

11. The fingerprint sensing module as defined in claim 1, wherein the at least one integrated circuit is attached to the sensor substrate by a flip chip bonding.

12. The fingerprint sensing module as defined in claim 1, wherein the at least one image pickup plate and the at least one image image drive plate are substantially coplanar.

13. A fingerprint sensing module, comprising:

a flexible substrate;

an image sensor including conductive traces on the flexible substrate, the conductive traces comprising;

at least one image pickup plate, and

at least one image drive plate in spaced relation to the at least one image pickup plate to define at least one sensor gap between the at least one image drive plate and the at least one image pickup plate, wherein ridge peaks and ridge valleys of a fingerprint over the at least one sensor gap produce a change in capacitance between the at least one image drive plate and the at least one image pickup plate;

a base, wherein the flexible substrate is wrapped around the base; and

a sensor circuit including at least one integrated circuit mounted on the flexible substrate and electrically connected to the image sensor.

14. The fingerprint sensing module of claim 13, wherein the base is positioned between the image sensor and the at least one integrated circuit.

15. A method for making a fingerprint sensing module, the method comprising:

providing a sensor substrate having a circuit side, wherein the sensor substrate comprises a flexible film;

forming an image sensor including conductive traces on the circuit side of the sensor substrate, the conductive traces comprising;

at least one image pickup plate, and

at least one image drive plate in spaced relation to the at least one image pickup plate to define at least one sensor gap between the at least one image drive plate and the at least one image pickup plate, wherein ridge peaks and ridge valleys of the fingerprint over the at least one sensor gap produce a change in capacitance between the at least one image drive plate and the at least one image pickup plate; and

mounting a sensor circuit including at least one integrated circuit on the circuit side of the sensor substrate, wherein the at least one integrated circuit is affixed to the sensor substrate by a chip-on-film process.