Package structure of fingerprint identification chip
First Claim
1. A package structure of a fingerprint identification chip, comprising:
- a metal substrate, having a through opening and two grooves extending from two opposite sides of the through opening;
a fingerprint identification chip, disposed in the through opening and having an upper surface and a lower surface, the lower surface having at least one bonding pad;
a cover plate, fixedly disposed on the metal substrate and covering the upper surface of the fingerprint identification chip;
a flexible printed circuit (FPC), disposed on the lower surface of the fingerprint identification chip and having a first surface and a second surface, the second surface having a first metal contact; and
a metal reinforcing plate, inserted into the two grooves and covering the through opening;
wherein the bonding pad is electrically connected to the first metal contact through a wire.
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Accused Products
Abstract
The present invention provides a package structure of a fingerprint identification chip, including: a metal substrate, having a through opening and two grooves extending from two opposite sides of the through opening; a fingerprint identification chip, disposed in the through opening and having an upper surface and a lower surface, the lower surface having a bonding pad; a cover plate, fixedly disposed on the metal substrate and covering the upper surface of the fingerprint identification chip; a flexible printed circuit (FPC), disposed on the lower surface of the fingerprint identification chip and having a first surface and a second surface, the second surface having a first metal contact; and a metal reinforcing plate, inserted into the two grooves and covering the through opening, where the bonding pad is electrically connected to the first metal contact through a wire.
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Citations
17 Claims
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1. A package structure of a fingerprint identification chip, comprising:
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a metal substrate, having a through opening and two grooves extending from two opposite sides of the through opening; a fingerprint identification chip, disposed in the through opening and having an upper surface and a lower surface, the lower surface having at least one bonding pad; a cover plate, fixedly disposed on the metal substrate and covering the upper surface of the fingerprint identification chip; a flexible printed circuit (FPC), disposed on the lower surface of the fingerprint identification chip and having a first surface and a second surface, the second surface having a first metal contact; and a metal reinforcing plate, inserted into the two grooves and covering the through opening; wherein the bonding pad is electrically connected to the first metal contact through a wire. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification