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Mixed three-dimensional memory

  • US 10,446,193 B2
  • Filed: 04/23/2017
  • Issued: 10/15/2019
  • Est. Priority Date: 04/14/2014
  • Status: Active Grant
First Claim
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1. A mixed three-dimensional memory (3D-Mx), comprising:

  • a first memory block, said first memory block comprising a first plurality of vertically stacked memory levels including a first topmost memory level, said first topmost memory level comprising a first memory array, said first memory array comprising first memory devices, each of said first memory devices sharing at least a first address-line with at least another one of said first memory devices;

    a second memory block, said second memory block comprising a second plurality of vertically stacked memory levels including a second topmost level, said second topmost memory level comprising a second memory array, said second memory array comprising second memory devices, each of said second memory devices sharing at least a second address-line with at least another one of said second memory devices;

    wherein, said second memory block is located side-by-side with said first memory block;

    said first topmost memory level is located at the same physical level with said second topmost memory level; and

    , said first memory array is physically larger and comprises more memory devices than said second memory array.

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