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System and method for dispensing liquid spin-on glass (SOG) onto semiconductor wafers

  • US 10,446,390 B2
  • Filed: 06/28/2013
  • Issued: 10/15/2019
  • Est. Priority Date: 06/28/2013
  • Status: Active Grant
First Claim
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1. A method of controlling deposition of liquid spin-on glass (SOG) onto a semiconductor wafer, comprising:

  • detecting, using a first sensor, the liquid SOG outside of a dispenser nozzle in an abnormal length relative to the dispenser nozzle;

    adjusting, using a controller, a suck back (SB) valve to withdraw liquid SOG from the abnormal length;

    comparing a sensed amount of liquid SOG deposited onto the semiconductor wafer, from a second sensor, with at least one operating parameter prior to the adjusting;

    pausing sensing of an amount of liquid SOG dispensed onto the semiconductor wafer based on the sensed amount of liquid SOG deposited being outside the at least one operating parameter; and

    storing at least one signal from the second sensor in the controller based on the sensed amount of liquid SOG deposited being outside the at least one operating parameter.

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