High-density semiconductor device
First Claim
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1. A method of manufacturing a semiconductor device, the method comprising:
- depositing a first material on a substrate;
forming a mandrel above the substrate;
depositing a spacer material on a sidewall of the mandrel;
removing the mandrel, thereby leaving a spacer;
forming a second material on a top surface and opposite first and second sidewalls of the spacer;
etching the second material on the first sidewall of the spacer to expose a portion of the first material;
removing the exposed portion of the first material to expose a portion of the substrate;
depositing on the exposed portion of the substrate a third material that has an etch selectivity different from an etch selectively of the first material;
depositing a second spacer material on the first and third materials; and
etching the substrate using the second spacer material as an etch mask to form a fin under the first material and a fin under the third material.
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Abstract
A method of manufacturing a semiconductor device includes depositing a first material on a substrate, depositing on the substrate a second material that has an etch selectivity different from an etch selectively of the first material, depositing a spacer material on the first and second material, and etching the substrate using the spacer material as an etch mask to form a fin under the first material and a fin under the second material.
4 Citations
20 Claims
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1. A method of manufacturing a semiconductor device, the method comprising:
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depositing a first material on a substrate; forming a mandrel above the substrate; depositing a spacer material on a sidewall of the mandrel; removing the mandrel, thereby leaving a spacer; forming a second material on a top surface and opposite first and second sidewalls of the spacer; etching the second material on the first sidewall of the spacer to expose a portion of the first material; removing the exposed portion of the first material to expose a portion of the substrate; depositing on the exposed portion of the substrate a third material that has an etch selectivity different from an etch selectively of the first material; depositing a second spacer material on the first and third materials; and etching the substrate using the second spacer material as an etch mask to form a fin under the first material and a fin under the third material. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of manufacturing a semiconductor device, the method comprising:
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forming above a substrate a spacer that has opposite first and second sidewalls; depositing a first material on the first and second sidewalls of the spacer; depositing a spacer material on the first material; converting the first material on the second sidewall of the spacer into a second material that has an etch selectivity different from an etch selectively of the first material; and etching the substrate using the spacer material as an etch mask to form a fin under the first material and a fin under the second material. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A semiconductor device, the comprising:
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a substrate; a first material formed on the substrate; a second material formed on the substrate; a plurality of fins formed from the substrate under the first and second materials; wherein the first and second materials are formed on the substrate by (1) forming above the substrate a spacer that has opposite first and second sidewalls, (2) depositing the first material on the first and second sidewalls of the spacer, (3) depositing a spacer material on the first material, (4) converting the first material on the second sidewall of the spacer into the second material, the second material having an etch selectivity different from an etch selectively of the first material; and wherein the plurality of fins are formed by etching the substrate using the spacer material as an etch mask. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification