×

Semiconductor package with filler particles in a mold compound

  • US 10,446,414 B2
  • Filed: 12/22/2017
  • Issued: 10/15/2019
  • Est. Priority Date: 12/22/2017
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor package, comprising:

  • an integrated circuit formed on a semiconductor substrate;

    a stress buffer layer on and directly contacting the semiconductor substrate; and

    a mold compound on a surface of the stress buffer layer opposite the integrated circuit;

    wherein the mold compound comprises a resin, and the resin includes filler particles; and

    wherein the filler particles have multiple sizes with the largest of the particles having a size between 5 microns and 32 microns.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×