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Patterned chuck for substrate processing

  • US 10,446,430 B2
  • Filed: 01/19/2017
  • Issued: 10/15/2019
  • Est. Priority Date: 01/19/2016
  • Status: Active Grant
First Claim
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1. A chuck for semiconductor wafer, comprising:

  • a body having an insulating top surface;

    a plurality of elongated bending means, each configured to cause bending of the wafer upon thermal expansion, such that the wafer assumes a corrugated shape, and wherein all of the elongated bending means are positioned parallel to each other;

    an electrode embedded within the body; and

    ,wherein each of the elongated bending means extends through part of the insulating top surface, such that an anchoring area is defined on the top surface having no elongated bending means therein.

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