Patterned chuck for substrate processing
First Claim
Patent Images
1. A chuck for semiconductor wafer, comprising:
- a body having an insulating top surface;
a plurality of elongated bending means, each configured to cause bending of the wafer upon thermal expansion, such that the wafer assumes a corrugated shape, and wherein all of the elongated bending means are positioned parallel to each other;
an electrode embedded within the body; and
,wherein each of the elongated bending means extends through part of the insulating top surface, such that an anchoring area is defined on the top surface having no elongated bending means therein.
1 Assignment
0 Petitions
Accused Products
Abstract
A chuck for wafer processing that counters the deleterious effects of thermal expansion of the wafer. Also, a combination of chuck and shadow mask arrangement that maintains relative alignment between openings in the mask and the wafer in spite of thermal expansion of the wafer. A method for fabricating a solar cell by ion implant, while maintaining relative alignment of the implanted features during thermal expansion of the wafer.
-
Citations
18 Claims
-
1. A chuck for semiconductor wafer, comprising:
-
a body having an insulating top surface; a plurality of elongated bending means, each configured to cause bending of the wafer upon thermal expansion, such that the wafer assumes a corrugated shape, and wherein all of the elongated bending means are positioned parallel to each other; an electrode embedded within the body; and
,wherein each of the elongated bending means extends through part of the insulating top surface, such that an anchoring area is defined on the top surface having no elongated bending means therein. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
- 9. A chuck for semiconductor wafer, comprising a plate having a top surface, a plurality of elongated straight ribs, each elongated straight rib extending the entire length of the top surface of the chuck, wherein the width and height of each elongated rib is configured such that when a chucking potential is applied to the chuck, the wafer bends around each elongated rib so that back surface of the wafer contacts the top surface of the chuck and the number of elongated ribs is configure to generate an expansion compensation to compensate for thermal expansion of the wafer upon heating.
-
17. A method for processing a semiconductor wafer, comprising:
-
providing a chuck having a top surface and a plurality of elongated bending means formed on the top surface; placing the wafer on the chuck; mechanically anchoring one side of the chuck; determining thermal expansion of the wafer; and applying a chucking potential to the chuck so as to cause the wafer to bend about each of the elongated bending means so that the wafer assumes a corrugated topography. - View Dependent Claims (18)
-
Specification