×

Fingerprint sensor and manufacturing method thereof

  • US 10,446,455 B2
  • Filed: 05/10/2017
  • Issued: 10/15/2019
  • Est. Priority Date: 05/12/2015
  • Status: Active Grant
First Claim
Patent Images

1. A fingerprint sensor device comprising:

  • a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides;

    a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the semiconductor die operates to sense a fingerprint of a finger positioned above the top die side;

    a plurality of conductive interconnection structures electrically connecting the bottom die side to the top substrate side; and

    a unitary encapsulant surrounding at least the lateral die sides and covering at least a portion of the top substrate side, wherein no portion of the encapsulant is higher than the top die side, and wherein no portion of the bottom substrate side is covered by the unitary encapsulant.

View all claims
  • 3 Assignments
Timeline View
Assignment View
    ×
    ×