Fingerprint sensor and manufacturing method thereof

• US 10,446,455 B2
• Filed: 05/10/2017
• Issued: 10/15/2019
• Est. Priority Date: 05/12/2015
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Park, Sung Sun, Chung, Ji Young, Berry, Christopher
• Primary Examiner(s): Whalen, Daniel
• Application Number:
  US15/591,416
• Publication Number:
  US 20170243798A1
• Time in Patent Office: 888 Days
• Field of Search: None
• CPC Class Codes: B81C 3/00 Assembling of devices or systems from individually processed components
• CPC Class Codes: G06V 40/13 Sensors therefor
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 2224/034 by blanket deposition of the material of the bonding area
• CPC Class Codes: H01L 2224/0345 Physical vapour deposition [PVD], e.g. evaporation, or sputtering
• CPC Class Codes: H01L 2224/03452 Chemical vapour deposition [CVD], e.g. laser CVD
• CPC Class Codes: H01L 2224/03464 Electroless plating
• CPC Class Codes: H01L 2224/0347 using a lift-off mask
• CPC Class Codes: H01L 2224/0361 Physical or chemical etching
• CPC Class Codes: H01L 2224/03912 the bump being used as a mask for patterning the bonding area
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05639 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05655 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05666 : Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05671 : Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05684 : Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/1132 : Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/11334 : using preformed bumps
• CPC Class Codes: H01L 2224/114 : by blanket deposition of the material of the bump connector
• CPC Class Codes: H01L 2224/1146 : Plating
• CPC Class Codes: H01L 2224/1147 : using a lift-off mask
• CPC Class Codes: H01L 2224/11849 : Reflowing
• CPC Class Codes: H01L 2224/119 : Methods of manufacturing bump connectors involving a specific sequence of method steps
• CPC Class Codes: H01L 2224/13013 : being rectangular or square
• CPC Class Codes: H01L 2224/13014 : being circular or elliptic
• CPC Class Codes: H01L 2224/131 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13111 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13294 : with a principal constituent of the material being a liquid not provided for in groups H01L2224/132 - H01L2224/13291
• CPC Class Codes: H01L 2224/133 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/27312 : Continuous flow, e.g. using a microsyringe, a pump, a nozzle or extrusion
• CPC Class Codes: H01L 2224/2732 : Screen printing, i.e. using a stencil
• CPC Class Codes: H01L 2224/27622 : Photolithography
• CPC Class Codes: H01L 2224/2784 : involving a mechanical process, e.g. planarising the layer connector
• CPC Class Codes: H01L 2224/29006 : Layer connector larger than the underlying bonding area
• CPC Class Codes: H01L 2224/29007 : Layer connector smaller than the underlying bonding area
• CPC Class Codes: H01L 2224/29011 : comprising apertures or cavities
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/2929 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29294 : with a principal constituent of the material being a liquid not provided for in groups H01L2224/292 - H01L2224/29291
• CPC Class Codes: H01L 2224/29299 : Base material
• CPC Class Codes: H01L 2224/2939 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/33181 : On opposite sides of the body
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 : Bump and layer connectors
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81424 : Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/81439 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/81444 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/81447 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/81455 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/8146 : Iron [Fe] as principal constituent
• CPC Class Codes: H01L 2224/81464 : Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/81466 : Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/81471 : Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/81484 : Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/8185 : using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/83101 : as prepeg comprising a layer connector, e.g. provided in an insulating plate member
• CPC Class Codes: H01L 2224/83102 : using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2224/92125 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 2224/92225 : the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/053 : the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/3128 : the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/27 : Manufacturing methods
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/33 : of a plurality of layer connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/069 : Polyurethane
• CPC Class Codes: H01L 2924/07025 : Polyimide
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/18161 : of a flip chip

Abstract

A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.

Claims

1. A fingerprint sensor device comprising:

a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides;

a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the semiconductor die operates to sense a fingerprint of a finger positioned above the top die side;

a plurality of conductive interconnection structures electrically connecting the bottom die side to the top substrate side; and

a unitary encapsulant surrounding at least the lateral die sides and covering at least a portion of the top substrate side, wherein no portion of the encapsulant is higher than the top die side, and wherein no portion of the bottom substrate side is covered by the unitary encapsulant.

2. The fingerprint sensor device of claim 1, wherein no portions of the lateral substrate sides are covered by the unitary encapsulant.

3. The fingerprint sensor device of claim 1, wherein the entire top side of the encapsulant that is laterally outside of a perimeter of the semiconductor die is in a single plane.

4. The fingerprint sensor device of claim 1, comprising a protective layer that directly contacts and covers at least a portion of the top die side, wherein the protective layer comprises only a single layer of a single material, and said at least a portion of the top die side is covered by no material other than the protective layer.

5. The fingerprint sensor device of claim 1, comprising a protective layer of a single material that directly contacts and covers the top die side and at least a portion of the top side of the encapsulant, and wherein the protective layer comprises a polymer coating.

6. The fingerprint sensor device of claim 1, wherein the encapsulant is exposed at the top side of the fingerprint sensor device.

7. The fingerprint sensor device of claim 6, wherein the bottom die side comprises bottom side electrical circuitry that comprises a fingerprint sensing unit.

8. The fingerprint sensor device of claim 1, wherein the fingerprint sensor device comprises a fingerprint sensor package, and comprising a conductive interconnect at the bottom substrate side and accessible at a bottom side of the fingerprint sensor package.

9. The fingerprint sensor device of claim 1, wherein the encapsulant is a molded encapsulant.

10. A method of manufacturing a fingerprint sensor device, the method comprising:

providing a substrate having a top substrate side, a bottom substrate side, and lateral substrate sides between the top and bottom substrate sides;

providing a semiconductor die having a top die side, a bottom die side, and lateral die sides between the top and bottom die sides, wherein the semiconductor die operates to sense a fingerprint of a finger positioned above the top die side;

connecting the bottom die side to the top substrate side utilizing a plurality of conductive interconnection structures; and

forming a unitary encapsulant surrounding at least the lateral die sides and covering at least a portion of the top substrate side, wherein no portion of the encapsulant is higher than the top die side, and wherein no portion of the bottom substrate side is covered by the unitary encapsulant.

11. The method of claim 10, wherein no portion of the lateral substrate sides is covered by the unitary encapsulant.

12. The method of claim 10, wherein said forming the encapsulant comprises forming the encapsulant such that the entire top side of the encapsulant around a perimeter of the semiconductor die is in a single plane.

13. The method of claim 10, comprising forming a protective layer that directly contacts and covers at least a portion of the top die side.

14. The method of claim 13, wherein the protective layer comprises only a single layer of a single material, and said at least a portion of the top die side is covered by no material other than the protective layer.