Packaged semiconductor devices with multi-use input contacts and related methods
First Claim
1. A packaged semiconductor device, comprising:
- a first input contact configured to receive a first input voltage;
a second input contact configured to receive a second input voltage;
one or more comparing elements configured to compare the first input voltage with the second input voltage, and;
one or more setting elements configured to set three operating parameters of the device in response to a comparison of the first input voltage and the second input voltage by the one or more comparing elements;
wherein the three operating parameters are supplied to an electronic component coupled with the device; and
wherein the three operating parameters are derived from no more input contacts than the first input contact and the second input contact.
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Accused Products
Abstract
A semiconductor device includes a first contact receiving a first voltage, a second contact receiving a second voltage, one or more comparing elements comparing the first and second voltages, and one or more setting elements setting one or more parameters of the device in response to a comparison of the first and second voltages. When the first voltage is greater than the second voltage the setting element selects the first voltage as a high voltage, the second voltage as a low voltage, and sets a mode signal to a first value. When the second voltage is greater than the first voltage the setting element selects the first voltage as the low voltage, the second voltage as the high voltage, and sets the mode signal to a second value. The first and second values alter a condition of an electronic component coupled with the device between a first and second state.
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Citations
20 Claims
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1. A packaged semiconductor device, comprising:
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a first input contact configured to receive a first input voltage; a second input contact configured to receive a second input voltage; one or more comparing elements configured to compare the first input voltage with the second input voltage, and; one or more setting elements configured to set three operating parameters of the device in response to a comparison of the first input voltage and the second input voltage by the one or more comparing elements; wherein the three operating parameters are supplied to an electronic component coupled with the device; and wherein the three operating parameters are derived from no more input contacts than the first input contact and the second input contact. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A packaged semiconductor device, comprising:
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a plurality of input contacts configured to receive a plurality of input voltages; one or more comparing elements configured to compare the plurality of input voltages; and one or more setting elements configured to, in response to a comparison of the plurality of input voltages by the one or more comparing elements, set a plurality of operating parameters which are supplied to an electronic component; wherein a number of operating parameters in the plurality of parameters is greater than a number of input contacts in the plurality of input contacts. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of use of a packaged semiconductor device, comprising:
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applying a plurality of input voltages to a plurality of input contacts; comparing the plurality of input voltages using one or more comparing elements of the device; and setting a plurality of operating parameters of the device using the plurality of input contacts; wherein a number of the plurality of operating parameters is greater than a number of the plurality of input contacts. - View Dependent Claims (17, 18, 19, 20)
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Specification