Offset interposers for large-bottom packages and large-die package-on-package structures
First Claim
Patent Images
1. An interposer, comprising:
- a land side including land-side ball-grid array (BGA) including land-side pads, wherein the land-side BOA is configured to interface with a first-level interconnect; and
a package-on-package (POP) side including a POP-side BOA including POP-side pads,wherein the POP-side BOA is configured to interface with a POP interconnect, wherein the land-side pads are coupled to the POP-side pads through the interposer,wherein the land-side pads have a different footprint than the respective POP-side pads,wherein the land side pads are configured at a first pitch and the POP-side pads are configured at a second pitchwherein the land-side pads have a first perimeter dimension and the POP-side pads have a second perimeter dimension, wherein the first perimeter dimension is larger than the second perimeter dimension, andwherein the POP-side pads include a first set of POP-side pads located on a first side of an interposer through hole and a second set of POP-side pads located on a second side of the interposer through hole, and along a first cross-section of the interposer, a number of pads in the first set of POP-side pads is greater than a number of pads in the second set of POP-side pads.
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Accused Products
Abstract
An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect. The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.
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Citations
24 Claims
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1. An interposer, comprising:
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a land side including land-side ball-grid array (BGA) including land-side pads, wherein the land-side BOA is configured to interface with a first-level interconnect; and a package-on-package (POP) side including a POP-side BOA including POP-side pads, wherein the POP-side BOA is configured to interface with a POP interconnect, wherein the land-side pads are coupled to the POP-side pads through the interposer, wherein the land-side pads have a different footprint than the respective POP-side pads, wherein the land side pads are configured at a first pitch and the POP-side pads are configured at a second pitch wherein the land-side pads have a first perimeter dimension and the POP-side pads have a second perimeter dimension, wherein the first perimeter dimension is larger than the second perimeter dimension, and wherein the POP-side pads include a first set of POP-side pads located on a first side of an interposer through hole and a second set of POP-side pads located on a second side of the interposer through hole, and along a first cross-section of the interposer, a number of pads in the first set of POP-side pads is greater than a number of pads in the second set of POP-side pads. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A package-on-package (POP) chip package comprising:
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An offset interposer including; a land side including land-side ball-grid array (BGA) including land-side pads, wherein the land-side BGA is configured to interface with a first-level interconnect; and a package-on-package (POP) side including a POP-side BGA including POP-side pads, wherein the POP-side BGA is configured to interface with a POP interconnect, wherein the land-side pads are coupled to the POP-side pads through the interposer wherein the land-side pads each have a different footprint than the respective POP-side pads, and wherein the land side pads are configured at a first pitch and the POP-side pads are configured at a second pitch, wherein the land-side pads have a first perimeter dimension and the POP-side pads have a second perimeter dimension, wherein the first perimeter dimension is larger than the second perimeter dimension, and wherein the POP-side pads include a first set of POP-side pads located on a first side of an interposer through hole and a second set of POP-side pads located on a second side of the interposer through hole, and along a first cross-section of the interposer, a number of pads in the first set of POP-side pads is greater than a number of pads in the second set of POP-side pads; a POP substrate coupled to POP interconnects on the POP-side BGA; and a microelectronic device disposed on the POP substrate, wherein the microelectronic device is electrically coupled to the offset interposer through the POP substrate. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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12. The POP chip package 11, wherein a given land-side pad is coupled to corresponding POP-side pad by direct contact with a via.
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21. A process of building an offset interposer, comprising:
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forming a land side including land-side ball-grid array (BGA) including land-side pads;
wherein the land-side BGA is configured to interface with a first-level interconnect; andforming a package-on-package (POP) side including a POP-side BGA including POP-side pads, wherein the POP-side BGA is configured to interface with a POP interconnect, wherein the land-side pads are coupled to the POP-side pads through the interposer, wherein the land-side pads have a different footprint than the POP-side pads, wherein the land side pads are configured at a first pitch and the POP-side pads are configured at a second pitch wherein the land-side pads have a first perimeter dimension and the POP-side pads have a second perimeter dimension;
wherein the first perimeter dimension is larger than the second perimeter dimensionwherein the POP-side pads include a first set of POP-side pads located on a first side of an interposer through hole and a second set of POP-side pads located on a second side of the interposer through hole, and along a first cross-section of the interposer, a number of pads in the first set of POP-side pads is greater than a number of pads in the second set of POP-side pads. - View Dependent Claims (22, 23, 24)
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Specification