Wafer level packaging of electronic devices
First Claim
1. A wafer level packaging of semiconductor devices, comprising:
- a semiconductor device with a top face, a bottom face, a metal pad located between the top and bottom faces;
a top cover layer affixed to the top face of the semiconductor device; and
a bottom cover wafer directly affixed to the bottom face of the semiconductor device, whereina VIA extends through external and internal faces of the bottom cover wafer and through the bottom face of the semiconductor device to the metal pad,a metal layer extends from the external face of the bottom cover wafer through the VIA to the metal pad, the metal layer including metal sidewall portions disposed on sidewalls of the VIA, the metal sidewall portions defining a hole therebetween, anda passivation layer is disposed in the VIA between each metal sidewall portion and the bottom cover wafer.
3 Assignments
0 Petitions
Accused Products
Abstract
Aspects of the invention are directed to an electronic device package including an electronic device comprising a first contact point; a metal pad disposed to provide electrical connection to the first contact point; a substrate comprising a first face and a second face opposing the first face of the substrate, the first face of the substrate adjacent a face of the electronic device; and a VIA passing through the substrate from the second face of the substrate to the metal pad, the VIA exhibiting: a pass through extending through the substrate from the first face to the second face; a metal layer disposed within the pass through arranged to provide electrical connectivity to the metal pad from an area adjacent the second face of the substrate; and an electrically insulating first passivation layer disposed between the metal layer and the substrate arranged to provide electrical insulation between the substrate and the metal layer.
24 Citations
9 Claims
-
1. A wafer level packaging of semiconductor devices, comprising:
-
a semiconductor device with a top face, a bottom face, a metal pad located between the top and bottom faces; a top cover layer affixed to the top face of the semiconductor device; and a bottom cover wafer directly affixed to the bottom face of the semiconductor device, wherein a VIA extends through external and internal faces of the bottom cover wafer and through the bottom face of the semiconductor device to the metal pad, a metal layer extends from the external face of the bottom cover wafer through the VIA to the metal pad, the metal layer including metal sidewall portions disposed on sidewalls of the VIA, the metal sidewall portions defining a hole therebetween, and a passivation layer is disposed in the VIA between each metal sidewall portion and the bottom cover wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
Specification