Display device having an electronic device disposed on a first pad and a second pad

• US 10,446,729 B1
• Filed: 03/22/2018
• Issued: 10/15/2019
• Est. Priority Date: 03/22/2018
• Status: Active Grant

• Current Assignee: InnoLux Corporation
• Original Assignee: InnoLux Corporation
• Inventors: Chen, Jia-Yuan, Tsai, Tsung-Han, Lee, Kuan-Feng, Wu, Yuan-Lin
• Primary Examiner(s): Nguyen, Khiem D
• Application Number:
  US15/928,238
• Publication Number:
  US 20190296202A1
• Time in Patent Office: 572 Days
• CPC Class Codes: B23K 35/26 with the principal constituent melting at less than 400 degrees C
• CPC Class Codes: B23K 35/262 Sn as the principal constituent
• CPC Class Codes: B23K 35/30 with the principal constituent melting at less than 1550 degrees C
• CPC Class Codes: B23K 35/32 with the principal constituent melting at more than 1550 degrees C
• CPC Class Codes: H01L 2224/13017 being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13024 the bump connector being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83862 Heat curing
• CPC Class Codes: H01L 2224/83871 Visible light curing
• CPC Class Codes: H01L 2224/83874 Ultraviolet [UV] curing
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 : comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 27/124 : with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits wiring structures per se H01L23/52
• CPC Class Codes: H01L 2924/10155 : being other than a cuboid
• CPC Class Codes: H01L 2933/0016 : relating to electrodes
• CPC Class Codes: H01L 2933/0025 : relating to coatings
• CPC Class Codes: H01L 2933/0066 : relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0075 : comprising nitride compounds
• CPC Class Codes: H01L 33/0093 : Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/06 : within the light emitting region, e.g. quantum confinement structure or tunnel barrier
• CPC Class Codes: H01L 33/32 : containing nitrogen
• CPC Class Codes: H01L 33/40 : Materials therefor
• CPC Class Codes: H01L 33/44 : characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0296 : Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 1/181 : associated with surface mounted components

Abstract

A display device is provided. The display device includes a substrate and a first metal line and a second metal line disposed on the substrate. The display device includes a first pad and a second pad disposed on the substrate and electrically connected to the first metal line and the second metal line respectively. The display device further includes an electronic device disposed on the first pad and the second pad. The electronic device includes a first connecting post and a second connecting post, wherein a distance between the first connecting post and the second connecting post is in a range from 1 um to 200 um. A portion of the first connecting post is embedded in the first pad and a portion of the second connecting post is embedded in the second pad.

Claims

1. A display device, comprising:

a substrate;

a first metal line and a second metal line disposed on the substrate;

a first pad and a second pad disposed on the substrate and electrically connected to the first metal line and the second metal line respectively; and

an electronic device disposed on the first pad and the second pad, and the electronic device comprising a first connecting post and a second connecting post;

wherein a distance between the first connecting post and the second connecting post is in a range from 1 um to 200 um,

wherein a portion of the first connecting post is embedded in the first pad and a portion of the second connecting post is embedded in the second pad, and

wherein the first pad comprises a bulging portion around the portion of the first connecting post that is embedded in the first pad, and a highest point of the bulging portion is higher than a top surface of the first pad out of the bulging portion along a normal direction of the substrate.

2. The display device as claimed in claim 1, wherein a melting temperature of the first metal line is higher than a melting temperature of the first pad.

3. The display device as claimed in claim 2, wherein a ratio of the melting temperature of the first metal line to the melting temperature of the first pad is in a range from 1.5 to 35.

4. The display device as claimed in claim 3, wherein the ratio is in a range from 1.5 to 17.

5. The display device as claimed in claim 1, wherein a ratio of a height of the portion of the first connecting post that is embedded in the first pad to a height of the first connecting post is in a range from 0.1 to 1.

6. The display device as claimed in claim 1, wherein the distance between the first connecting post and the second connecting post is in a range from 2 um to 50 um.

7. The display device as claimed in claim 1, wherein the first pad at least partially overlaps the first metal line.

8. The display device as claimed in claim 1, wherein a melting temperature of the first connecting post is higher than a melting temperature of the first pad.

9. The display device as claimed in claim 1, further comprising an adhesive layer disposed between the electronic device and the substrate.

10. The display device as claimed in claim 9, wherein the adhesive layer comprises a swelling portion around the portion of the first connecting post that is embedded in the first pad.

11. The display device as claimed in claim 9, wherein the adhesive layer covers the first pad.

12. The display device as claimed in claim 9, wherein the adhesive layer is an insulator.

13. A display device, comprising:

an integrated electronic component, comprising;

a first substrate;

a first metal line and a second metal line disposed on the first substrate;

a first pad and a second pad disposed on the first substrate and electrically connected to the first metal line and the second metal line respectively; and

an electronic device disposed on the first pad and the second pad, and the electronic device comprising a first connecting post and a second connecting post, wherein a portion of the first connecting post is embedded in the first pad and a portion of the second connecting post is embedded in the second pad;

a second substrate disposed below the integrated electronic component; and

a third pad and a fourth pad disposed on the second substrate and electrically connected to the first metal line and the second metal line respectively;

wherein the first metal line comprises a third connecting post and the second metal line comprises a fourth connecting post,

wherein the third connecting post and the fourth connecting post are in contact with the third pad and the fourth pad respectively, and

wherein the first pad comprises a bulging portion around the portion of the first connecting post that is embedded in the first pad, and a highest point of the bulging portion is higher than a top surface of the first pad out of the bulging portion along a normal direction of the first substrate.

14. The display device as claimed in claim 13, wherein a distance between the third connecting post and the fourth connecting post is greater than a distance between the first connecting post and the second connecting post.

15. The display device as claimed in claim 13, wherein an area of the third pad is greater than an area of the first pad.

16. The display device as claimed in claim 13, wherein a melting temperature of the first metal line is higher than a melting temperature of the third pad.

17. The display device as claimed in claim 13, wherein a melting temperature of the third connecting post is higher than a melting temperature of the third pad.

18. The display device as claimed in claim 13, wherein a thickness of the first pad is greater than a thickness of the first metal line.

19. The display device as claimed in claim 13, wherein a portion of the third connecting post is embedded in the third pad and a portion of the fourth connecting post is embedded in the fourth pad.