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Magnetic tunnel junction wafer adaptor used in magnetic annealing furnace and method of using the same

  • US 10,446,744 B2
  • Filed: 03/08/2018
  • Issued: 10/15/2019
  • Est. Priority Date: 03/08/2018
  • Status: Active Grant
First Claim
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1. A planar wafer adaptor comprises:

  • a planar body;

    a first cutout from the planar body;

    a first boundary having a perimeter contour substantially equivalent to a semiconductor wafer of a first dimension;

    a second boundary along said first cutout and having a perimeter contour substantially equivalent to a semiconductor wafer of a second dimension; and

    a lateral step disposed along said second boundary and configured to support an edge of said semiconductor wafer of said second dimension and configured to align said semiconductor wafer of said second dimension in a horizontal orientation when said planar body is aligned horizontally, wherein said planar body has a thermal mass that is substantially equal to a thermal mass of a semiconductor wafer of said first dimension minus an expected thermal mass of said semiconductor wafer of said second dimension.

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