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Three dimensional inductor-capacitor apparatus and method of fabricating

  • US 10,447,226 B2
  • Filed: 12/21/2017
  • Issued: 10/15/2019
  • Est. Priority Date: 12/21/2017
  • Status: Active Grant
First Claim
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1. An apparatus comprising:

  • a plurality of stacked metal layers, including;

    a first metal layer including a first inductor, the first inductor configured in a spiral shape;

    a second metal layer including a plurality of first pads and a plurality of second pads;

    a third metal layer including a plurality of third pads and a plurality of fourth pads;

    a fourth metal layer including a second inductor, the second inductor configured in a spiral shape;

    a plurality of first vias configured to couple the first metal layer to the second metal layer;

    a plurality of second vias configured to couple the second metal layer to the third metal layer;

    a plurality of third vias configured to couple the third metal layer to the fourth metal layer;

    a dielectric layer at least partially surrounding the apparatus; and

    a first capacitor, wherein the first capacitor includes at least a portion of the first metal layer, and at least one of the plurality of first pads, separated by the dielectric layer.

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