Electronic device having a composite structure

• US 10,447,834 B2
• Filed: 05/26/2017
• Issued: 10/15/2019
• Est. Priority Date: 09/21/2016
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Misra, Abhijeet, Osborne, Steven J., Spraggs, Ian A., Rammah, Marwan, Counts, William A.
• Primary Examiner(s): Wu, Jerry
• Application Number:
  US15/606,920
• Publication Number:
  US 20180084653A1
• Time in Patent Office: 872 Days
• Field of Search: 36167901
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/163 Wearable computers, e.g. on a belt
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/026 Details of the structure or mounting of specific components
• CPC Class Codes: H04M 1/0283 for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
• CPC Class Codes: H04M 1/185 Improving the rigidity of the casing or resistance to shocks

Abstract

Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.

Claims

1. An enclosure for an electronic device, comprising:

an enclosure component formed from aluminum and defining;

an exterior surface of the enclosure;

an interior surface opposite the exterior surface; and

a uniform-thickness region having a uniform thickness between the interior surface and the exterior surface;

a fastener feature formed from steel and affixed to the enclosure component along a bonding region and the uniform-thickness region, the fastener feature affixed to the enclosure component with a blended melt layer comprising;

an interstitial material having a melting temperature less than a melting temperature of either the aluminum or the steel; and

a portion of the aluminum from the enclosure component blended with the interstitial material; and

a rib formed of steel and affixed to the enclosure component within the uniform-thickness region with an additional blended melt layer, the rib defining a passage configured to receive at least a portion of a component of the electronic device.

2. The enclosure of claim 1, wherein the interstitial material comprises at least one of nickel, zinc, or aluminum alloy.

3. The enclosure of claim 1, wherein:

the enclosure is configured to receive a printed circuit board (PCB); and

the fastener feature is configured to secure the PCB to the enclosure component.

4. The enclosure of claim 1, further comprising an electrical shield affixed to the enclosure component along the interior surface of the enclosure.

5. The enclosure of claim 1, wherein the rib extends from a first sidewall defined by the enclosure component to a second sidewall defined by the enclosure component.

6. The enclosure of claim 1, wherein the fastener feature is a fastener.

7. A method of manufacturing an enclosure for an electronic device, comprising:

forming an enclosure component from aluminum, the enclosure component defining;

an exterior surface of the enclosure;

an interior surface opposite the exterior surface; and

a uniform-thickness region having a uniform thickness between the interior surface and the exterior surface;

affixing a fastener feature formed from steel to the enclosure component along a bonding region and the uniform-thickness region, the fastener feature affixed to the enclosure component with a blended melt layer comprising;

an interstitial material having a melting temperature less than a melting temperature of either the aluminum or the steel; and

a portion of the aluminum from the enclosure component blended with the interstitial material; and

affixing a rib formed of steel to the enclosure component within the uniform-thickness region with an additional blended melt layer, the rib defining a passage configured to receive at least a portion of a component of the electronic device.

8. The method of claim 7, wherein the interstitial material comprises at least one of nickel, zinc, or aluminum alloy.

9. The method of claim 7, wherein:

the enclosure is configured to receive a printed circuit board (PCB); and

the fastener feature is configured to secure the PCB to the enclosure component.

10. The method of claim 7, further comprising affixing an electrical shield to the enclosure component along the interior surface of the enclosure.

11. The method of claim 7, wherein the rib extends from a first sidewall defined by the enclosure component to a second sidewall defined by the enclosure component.

12. The method of claim 7, wherein the fastener feature is a fastener.

13. A laptop computer, comprising:

a lid portion comprising a display; and

a base portion comprising a keyboard and pivotally coupled to the lid portion, the base portion comprising;

an enclosure component formed from aluminum and defining;

an exterior surface of the enclosure;

an interior surface opposite the exterior surface; and

a uniform-thickness region having a uniform thickness between the interior surface and the exterior surface;

a fastener feature formed from steel and affixed to the enclosure component along a bonding region and the uniform-thickness region, the fastener feature affixed to the enclosure component with a blended melt layer comprising;

an interstitial material having a melting temperature less than a melting temperature of either the aluminum or the steel; and

a portion of the aluminum from the enclosure component blended with the interstitial material; and

a rib formed of steel and affixed to the enclosure component within the uniform-thickness region with an additional blended melt layer, the rib defining a passage configured to receive at least a portion of a component of the laptop computer.

14. The laptop computer of claim 13, wherein the interstitial material comprises at least one of nickel, zinc, or aluminum alloy.

15. The laptop computer of claim 13, wherein:

the enclosure is configured to receive a printed circuit board (PCB); and

the fastener feature is configured to secure the PCB to the enclosure component.

16. The laptop computer of claim 13, further comprising an electrical shield affixed to the enclosure component along the interior surface of the enclosure.

17. The laptop computer of claim 13, wherein the rib extends from a first sidewall defined by the enclosure component to a second sidewall defined by the enclosure component.

18. The laptop computer of claim 13, wherein the fastener feature is a fastener.