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Light emitting diode heat sink

  • US 10,448,459 B2
  • Filed: 01/28/2019
  • Issued: 10/15/2019
  • Est. Priority Date: 09/30/2016
  • Status: Active Grant
First Claim
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1. A heating apparatus comprising:

  • a light emitting diode (LED) array comprising an LED to heat a target object; and

    a heat sink thermally coupled to the LED array, to dissipate heat from the LED array, the heat sink comprising a plurality of refrigerant paths to pass a refrigerant through the heat sink in a plurality of different directions, wherein a refrigerant path of the plurality of refrigerant paths comprises a conduit that extends from outside the heat sink and that extends through an inner portion of the heat sink, wherein an outer surface of the conduit is in thermal contact with an inner surface of the heat sink.

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