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Printed circuit board and semiconductor package including the same

  • US 10,448,508 B2
  • Filed: 03/21/2017
  • Issued: 10/15/2019
  • Est. Priority Date: 03/22/2016
  • Status: Active Grant
First Claim
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1. A printed circuit board (PCB) comprising:

  • a substrate base;

    a plurality of pads on upper and lower surfaces of the substrate base, the plurality of pads including a first surface parallel to the upper or lower surface of the substrate base and facing toward the substrate base, a second surface opposite the first surface and an edge surface extending from the first surface to the second surface; and

    a solder resist layer covering at least a portion of the upper and lower surfaces of the substrate base,wherein at least some of the plurality of pads are groove pads comprising at least one annular groove in the second surface,wherein, for each of the groove pads, a portion of the first surface extending from the edge surface is coplanar with another portion of the first surface located between the at least one annular groove and the substrate base;

    wherein the groove pads comprise a first groove pad including one annular groove and a second groove pad including two annular grooves,wherein the first groove pad is disposed closer to a center of the substrate base from a perimeter of the substrate base relative to the second groove pad.

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