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Densified foam for thermal insulation in electronic devices

  • US 10,448,541 B2
  • Filed: 11/21/2016
  • Issued: 10/15/2019
  • Est. Priority Date: 11/19/2015
  • Status: Active Grant
First Claim
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1. A heat spreading and insulating material for use with a mobile device having heat generating components and heat sensitive components, said material comprising:

  • a unitary thermal insulating layer formed from a densified sheet of polyimide open cell foam, said densified sheet having a first density between 25-60 kg/m3, said densified sheet having an outwardly facing surface and an oppositely located inwardly facing surface, said outwardly facing surface being spaced from said inwardly facing surface to define a first thickness;

    said unitary thermal insulating layer having further densified areas where said insulating layer is further densified to have a density greater than said first density, said outwardly facing surface is spaced from said inwardly facing surface to define a second thickness in said further densified areas said second thickness being smaller than said first thickness;

    a first adhesive layer having a first adhesive surface and an oppositely located second adhesive surface, said inwardly facing surface of said insulating layer adheredly contacting said first adhesive surface, said first adhesive layer conforming to said inwardly facing surface;

    a heat spreading layer formed from compressed graphite flakes that conducts heat anisotropically and having an adhesive facing surface and an oppositely located component facing surface, said adhesive facing surface separated from said component facing surface to define a thickness, said adhesive facing surface adheredly contacting said second adhesive surface of said first adhesive layer, said heat spreading layer conforming to said second adhesive surface.

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