Moldable adhesive wafers

• US 10,449,082 B2
• Filed: 05/23/2014
• Issued: 10/22/2019
• Est. Priority Date: 07/23/2013
• Status: Active Grant

• Current Assignee: Convatec Incorporated (ConvaTec Group Plc)
• Original Assignee: Convatec Incorporated (ConvaTec Group Plc)
• Inventors: Johnsen, Kenneth
• Primary Examiner(s): Zalukaeva, Tatyana
• Assistant Examiner(s): Townsend, Guy K
• Application Number:
  US14/907,166
• Publication Number:
  US 20160151197A1
• Time in Patent Office: 1,978 Days
• CPC Class Codes: A61F 13/0246 characterised by the skin-adhering layer
• CPC Class Codes: A61F 5/443 having adhesive seals for securing to the body, e.g. of hydrocolloid type, e.g. gels, starches, karaya gums adhesives or sealing pads therefor A61L24/00
• CPC Class Codes: A61F 5/445 Colostomy, ileostomy or urethrostomy devices A61F5/441, A61F5/442, A61F5/443 take precedence
• CPC Class Codes: A61F 5/448 Means for attaching bag to seal ring
• CPC Class Codes: A61L 24/001 Use of materials characterised by their function or physical properties

Abstract

Disclosed herein are methods and devices for coupling and securing a medical device appliance. In particular, one piece moldable adhesive structures are disclosed which allow customization of an attachment wafer to the size and shape of, for example, a stoma, while allowing flexibility and security for attaching a medical device, such as an ostomy pouch or other device to the subject.

Claims

1. A moldable adhesive comprising:

at least two adhesive layers; and

at least one layer of thin, flexible, elastic film between two adjacent adhesive layers to form a composite adhesive structure;

wherein a proximal surface of the moldable adhesive is attached to a distal surface of a wafer unit and the distal surface of the moldable adhesive faces away from a subject'"'"'s body, wherein the moldable adhesive is capable of rolling or folding proximally towards the subject'"'"'s body onto itself such that an inner surface of the composite adhesive structure formed upon rolling provides a counteracting force to allow an edge of the rolled composite adhesive structure to partially return to its original size and shape, and

wherein a proximal surface of the wafer unit is configured to be attached to the subject'"'"'s body.

2. The moldable adhesive of claim 1, wherein the molded surface of the wafer unit has a layer of film extending partially across the molded surface, such that an inner opening of the layer of film is larger than an inner opening of the molded surface.

3. The moldable adhesive of claim 2, wherein the layer of film is flexible.

4. The moldable adhesive of claim 2, wherein the moldable adhesive provides an adhesive base of attachment for a faceplate of an ostomy pouch.

5. The moldable adhesive of claim 4, wherein the faceplate is connected to the ostomy pouch as a separate element.

6. The moldable adhesive of claim 4, wherein the faceplate is adhesive.

7. The moldable adhesive of claim 4, wherein an outer edge of the composite adhesive structure is larger than an opening in the faceplate of the ostomy pouch.

8. The moldable adhesive of claim 1, wherein the two adjacent adhesive layers comprise the same adhesive formulation.

9. The moldable adhesive of claim 1, wherein the two adjacent adhesive layers comprise different adhesive formulations.

10. The moldable adhesive of claim 1, wherein outer and inner edges of the composite adhesive structure are closed, non-intersecting geometric figures.

11. The moldable adhesive of claim 10, wherein the closed, non-intersecting geometric figures comprise a conic figure.

12. The moldable adhesive of claim 10, wherein the closed, non-intersecting geometric figures comprise a circle.

13. The moldable adhesive of claim 10, wherein the closed, non-intersecting geometric figures comprise a polygon.

14. A moldable ostomy appliance comprising a moldable ostomy wafer and an ostomy pouch, wherein the moldable ostomy wafer comprises the moldable adhesive of claim 1.

15. The moldable adhesive of claim 10, wherein the proximal surface of the wafer unit is adhesive.