Hermetic terminal for an AIMD having a pin joint in a feedthrough capacitor or circuit board
First Claim
1. A hermetically sealed feedthrough subassembly attachable to an active implantable medical device (AIMD), the feedthrough subassembly comprising:
- a) an insulator substrate assembly, comprising;
i) an insulator body defined as having a body fluid side opposite a device side, the body fluid side and device side separated and connected by at least one outer perimeter surface;
ii) at least one via hole disposed through the insulator body and extending from the body fluid side to the device side;
iii) an internal metallization formed at least partially on an inside of the at least one via hole;
iv) a first conductive leadwire extending from a first end to a second end, wherein the first conductive leadwire is at least partially disposed within the at least one via hole and wherein the first conductive leadwire first end is disposed outwardly beyond the device side of the insulator body;
v) a first braze residing at least partially between the first conductive leadwire and the internal metallization, the first braze forming a first hermetic seal separating the body fluid side from the device side; and
vi) an external metallization disposed at least partially on the at least one outer perimeter surface of the insulator body; and
b) a ferrule, comprising;
i) a conductive ferrule body defined as having a ferrule first side opposite a ferrule second side and defining a ferrule opening between and through the ferrule first and second sides, wherein the insulator body is at least partially disposed within the ferrule opening; and
ii) a second braze residing at least partially between the external metallization of the insulator body and the conductive ferrule body, the second braze forming a second hermetic seal hermetically sealing the ferrule opening;
c) a feedthrough filter capacitor disposed on the device side, the feedthrough filter capacitor comprising;
i) at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate, wherein the active and ground electrode plates are disposed within a capacitor dielectric substrate;
ii) a first passageway disposed through the capacitor dielectric substrate and disposed perpendicular to the active and ground electrode plates; and
iii) a capacitor internal metallization disposed within the first passageway and being electrically connected to the at least one active electrode plate and in non-conductive relation with the at least one ground electrode plate;
iv) wherein the first conductive leadwire first end is disposed within the first passageway;
d) a second conductive leadwire disposed on the device side and having a second conductive leadwire first end at least partially disposed within the first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed outwardly beyond the feedthrough filter capacitor, the second conductive leadwire second end being configured to be connectable to electronics internal to the AIMD, wherein the second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end; and
e) a first electrically conductive material forming at least a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and the capacitor internal metallization together.
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Accused Products
Abstract
A hermetically sealed feedthrough subassembly attachable to an active implantable medical device includes a first conductive leadwire extending from a first end to a second end, the first conductive leadwire first end disposed past a device side of an insulator body. A feedthrough filter capacitor is disposed on the device side. A second conductive leadwire is disposed on the device side having a second conductive leadwire first end at least partially disposed within a first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed past the feedthrough filter capacitor configured to be connectable to AIMD internal electronics. The second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end. A first electrically conductive material forms a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and a capacitor internal metallization.
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Citations
23 Claims
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1. A hermetically sealed feedthrough subassembly attachable to an active implantable medical device (AIMD), the feedthrough subassembly comprising:
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a) an insulator substrate assembly, comprising; i) an insulator body defined as having a body fluid side opposite a device side, the body fluid side and device side separated and connected by at least one outer perimeter surface; ii) at least one via hole disposed through the insulator body and extending from the body fluid side to the device side; iii) an internal metallization formed at least partially on an inside of the at least one via hole; iv) a first conductive leadwire extending from a first end to a second end, wherein the first conductive leadwire is at least partially disposed within the at least one via hole and wherein the first conductive leadwire first end is disposed outwardly beyond the device side of the insulator body; v) a first braze residing at least partially between the first conductive leadwire and the internal metallization, the first braze forming a first hermetic seal separating the body fluid side from the device side; and vi) an external metallization disposed at least partially on the at least one outer perimeter surface of the insulator body; and b) a ferrule, comprising; i) a conductive ferrule body defined as having a ferrule first side opposite a ferrule second side and defining a ferrule opening between and through the ferrule first and second sides, wherein the insulator body is at least partially disposed within the ferrule opening; and ii) a second braze residing at least partially between the external metallization of the insulator body and the conductive ferrule body, the second braze forming a second hermetic seal hermetically sealing the ferrule opening; c) a feedthrough filter capacitor disposed on the device side, the feedthrough filter capacitor comprising; i) at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate, wherein the active and ground electrode plates are disposed within a capacitor dielectric substrate; ii) a first passageway disposed through the capacitor dielectric substrate and disposed perpendicular to the active and ground electrode plates; and iii) a capacitor internal metallization disposed within the first passageway and being electrically connected to the at least one active electrode plate and in non-conductive relation with the at least one ground electrode plate; iv) wherein the first conductive leadwire first end is disposed within the first passageway; d) a second conductive leadwire disposed on the device side and having a second conductive leadwire first end at least partially disposed within the first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed outwardly beyond the feedthrough filter capacitor, the second conductive leadwire second end being configured to be connectable to electronics internal to the AIMD, wherein the second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end; and e) a first electrically conductive material forming at least a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and the capacitor internal metallization together. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A hermetically sealed feedthrough subassembly attachable to an active implantable medical device (AIMD), the feedthrough subassembly comprising:
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a) an insulator body defined as having a body fluid side opposite a device side, the body fluid side and device side separated and connected by at least one outer perimeter surface, wherein at least one via hole disposed through the insulator body extends from the body fluid side to the device side; b) an internal metallization formed at least partially on an inside of the at least one via hole; c) a first conductive leadwire extending from a first end to a second end, wherein the first conductive leadwire is at least partially disposed within the at least one via hole and wherein the first conductive leadwire first end is disposed outwardly beyond the device side of the insulator body; d) a first gold braze residing at least partially between the first conductive leadwire and the internal metallization, the first gold braze forming a first hermetic seal separating the body fluid side from the device side; e) an external metallization disposed at least partially on the at least one outer perimeter surface of the insulator body; and f) a conductive ferrule body defined as having a ferrule first side opposite a ferrule second side and defining a ferrule opening between and through the ferrule first and second sides, wherein the conductive ferrule body is configured to be joined to an opening in an AIMD housing by a laser weld or braze; g) a second gold braze residing at least partially between the external metallization of the insulator body and the conductive ferrule body, the second gold braze forming a second hermetic seal hermetically sealing the ferrule opening to the conductive ferrule body; h) a feedthrough filter capacitor disposed on the device side, the feedthrough filter capacitor comprising; i) at least one active electrode plate disposed parallel and spaced from at least one ground electrode plate, wherein the active and ground electrode plates are disposed within a capacitor dielectric substrate; ii) a first passageway disposed through the capacitor dielectric substrate and disposed perpendicular to the first and second plates; and iii) a capacitor internal metallization disposed within the first passageway and being electrically connected to the at least one active electrode plate and in non-conductive relation with the at least one ground electrode plate; iv) wherein the first conductive leadwire first end is disposed within the first passageway; i) a second conductive leadwire disposed on the device side and having a second conductive leadwire first end at least partially disposed within the first passageway of the feedthrough filter capacitor and having a second conductive leadwire second end disposed outwardly beyond the feedthrough filter capacitor, the second conductive leadwire second end being configured to be connectable to electronics internal to the AIMD, wherein the second conductive leadwire first end is at, near or adjacent to the first conductive leadwire first end, and wherein the first conductive leadwire is not of the same material as the second conductive leadwire; and j) a first electrically conductive material forming at least a three-way electrical connection electrically connecting the second conductive leadwire first end, the first conductive leadwire first end and the capacitor internal metallization together.
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Specification