Plasma abatement of compounds containing heavy atoms
First Claim
1. An apparatus for abating effluent from a processing chamber, comprising:
- a plasma source coupled to a gas line of a deposition chamber, the plasma source comprising;
a first plate having an outer edge and an inner edge;
a second plate parallel to the first plate, wherein the second plate has an outer edge and an inner edge;
an inner wall disposed between the inner edges of the first and second plates, wherein the first plate and the second plate are concentric with the inner wall;
an outer wall disposed between the outer edges of the first and second plates, the first plate, the second plate, the inner wall and the outer wall defining a plasma region;
a first plurality of magnets disposed on the first plate; and
a second plurality of magnets disposed on the second plate; and
a reagent source positioned upstream of the plasma source, wherein the reagent source is coupled with the plasma source, and wherein the reagent source is operable to deliver an abating reagent to the plasma source.
1 Assignment
0 Petitions
Accused Products
Abstract
A plasma abatement process for abating effluent containing compounds from a processing chamber is described. A plasma abatement process takes gaseous foreline effluent from a processing chamber, such as a deposition chamber, and reacts the effluent within a plasma chamber placed in the foreline path. The plasma dissociates the compounds within the effluent, converting the effluent into more benign compounds. Abating reagents may assist in the abating of the compounds. The abatement process may be a volatizing or a condensing abatement process. Representative volatilizing abating reagents include, for example, CH4, H2O, H2, NF3, SF6, F2, HCl, HF, Cl2, and HBr. Representative condensing abating reagents include, for example, H2, H2O, O2, N2, O3, CO, CO2, NH3, N2O, CH4, and combinations thereof.
-
Citations
12 Claims
-
1. An apparatus for abating effluent from a processing chamber, comprising:
-
a plasma source coupled to a gas line of a deposition chamber, the plasma source comprising; a first plate having an outer edge and an inner edge; a second plate parallel to the first plate, wherein the second plate has an outer edge and an inner edge; an inner wall disposed between the inner edges of the first and second plates, wherein the first plate and the second plate are concentric with the inner wall; an outer wall disposed between the outer edges of the first and second plates, the first plate, the second plate, the inner wall and the outer wall defining a plasma region; a first plurality of magnets disposed on the first plate; and a second plurality of magnets disposed on the second plate; and a reagent source positioned upstream of the plasma source, wherein the reagent source is coupled with the plasma source, and wherein the reagent source is operable to deliver an abating reagent to the plasma source. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
-
-
12. An apparatus for abating effluent from a processing chamber, comprising:
-
a plasma source coupled to a gas line of a deposition chamber, the plasma source comprising; a first plate having an outer edge and an inner edge; a second plate parallel to the first plate, wherein the second plate has an outer edge and an inner edge; an inner wall disposed between the inner edges of the first and second plates, wherein the first plate and the second plate are concentric with the inner wall; an outer wall disposed between the outer edges of the first and second plates, the first plate, the second plate, the inner wall and the outer wall defining a plasma region therein; a first magnet disposed on the first plate; and a second magnet disposed on the second plate; and a reagent source positioned upstream of the plasma source, wherein the reagent source is coupled with the plasma source, and wherein the reagent source is operable to deliver an abating reagent to the plasma source.
-
Specification