Masking substrates for application of protective coatings

• US 10,449,568 B2
• Filed: 01/17/2014
• Issued: 10/22/2019
• Est. Priority Date: 01/08/2013
• Status: Active Grant

• Current Assignee: HzO, Inc.
• Original Assignee: HzO, Inc.
• Inventors: Astle, David James, Child, Tyler Christensen, Kasagani, Vimal Kumar, Loose, Cameron LaMar, Stevens, Blake LeRoy, Sorenson, Max Ernest
• Primary Examiner(s): Turocy, David P
• Assistant Examiner(s): Mayy, Mohammad
• Application Number:
  US14/157,684
• Publication Number:
  US 20140192464A1
• Time in Patent Office: 2,104 Days
• CPC Class Codes: B05D 1/322 Removable films used as masks
• CPC Class Codes: C09J 2301/304 the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
• CPC Class Codes: C09J 9/00 Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks C09J7/00 takes precedence
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/67011 Apparatus for manufacture or treatment processes H01L21/30, H01L21/46; for production or after-treatment of single crystals or homogeneous polycrystalline material C30B35/00
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/0145 Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
• CPC Class Codes: H05K 2201/09872 Insulating conformal coating
• CPC Class Codes: H05K 3/0073 Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
• CPC Class Codes: H05K 3/0079 characterised by the method of application or removal of the mask H05K3/0091 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.

Claims

1. A method for protectively coating a substrate, comprising:

introducing a flowable mask material into at least one selected communication port of a substrate to define a mask in the at least one selected communication port, the flowable mask material substantially conforming a shape of a surface of the at least one selected communication port under natural force;

applying a mechanical force to the flowable mask material to conform the flowable mask material to the shape of the surface of the at least one selected communication port after the flowable mask material has been introduced into the at least one selected communication port, wherein the mechanical force is applied by an instrument that does not form a part of a finished device including the substrate, wherein the mask bonds to the substrate;

applying a protective coating over the substrate and over the mask, such that the protective coating adheres to the substrate and the mask;

cutting the protective coating at locations outside an outer perimeter of the mask, wherein cuts from the cutting the protective coating does not extend completely through the protective coating; and

removing the mask and at least a portion of the protective coating over the mask.

2. The method of claim 1, wherein introducing the flowable mask material comprises introducing the flowable mask material into a connector of an electronic assembly and wherein the mechanical force applied by the instrument is different than an applicator instrument that applies the liquid masking material.

3. The method of claim 1, wherein introducing the flowable mask material comprises introducing a hot melt adhesive into the at least one selected communication port.

4. The method of claim 1, wherein removing the mask and at least the portion of the protective coating over the mask comprises removing locations of the protective coating over or adjacent to a perimeter of the mask material.

5. The method of claim 4, further comprising:

pulling at least the portion of the protective coating from the mask material or from the substrate.

6. The method of claim 5, further comprising:

pulling the mask material from the substrate, with a portion of the protective coating remaining on protected areas of the substrate.

7. The method of claim 1, further comprising:

inserting a plug into the at least one selected communication port in the substrate before introducing the flowable mask material.

8. The method of claim 7, wherein introducing the flowable mask material comprises applying a seal around the plug to create a seal between the plug and the substrate at an opening of the at least one selected port.

9. A method for applying a protective coating to a substrate, comprising:

applying a liquid mask material to at least one selected location of an electronic device assembly, the at least one selected location being a location to be exposed through a protective coating, including introducing the liquid masking material into at least one communication port of the electronic device assembly, the liquid mask material flowing to substantially conform to a shape of a surface of the at least one selected location of the electronic device assembly upon being applied to the at least one selected location of the electronic device assembly;

applying a mechanical force to the liquid mask material to conform the liquid mask material to the shape of the surface of the at least one selected location after the liquid mask material has been applied to the at least one selected location, wherein the mechanical force is applied by an instrument that does not form a part of a finished device including the substrate;

allowing the liquid mask material to substantially harden and bond to the substrate, by cooling to an ambient temperature, to define a mask;

after the mask is hardened, applying the protective coating over the mask and the electronic device assembly, such that the protective coating adheres to the mask and the electronic device assembly;

cutting the protective coating at locations outside an outer perimeter of the mask; and

removing the mask and at least a portion of the protective coating over the mask.

10. The method of claim 9, wherein applying the protective coating over the mask comprises applying a coating comprising poly(p-xylylene) and wherein the mechanical force applied by the instrument is different than an applicator instrument that applies the liquid masking material.

11. The method of claim 9, wherein applying the protective coating over the mask comprises applying a coating comprising aluminum oxide.