Device for delaminating laminate, delamination method, and method for manufacturing electronic device

• US 10,449,755 B2
• Filed: 04/06/2018
• Issued: 10/22/2019
• Est. Priority Date: 10/16/2015
• Status: Active Grant

• Current Assignee: AGC, Inc.
• Original Assignee: AGC, Inc.
• Inventors: Watanabe, Yasuaki, Nakamura, Koji, Kondo, Tsubasa, Ito, Yasunori, Hori, Yuki, Utsugi, Hiroshi
• Primary Examiner(s): Osele, Mark A
• Application Number:
  US15/946,820
• Publication Number:
  US 20180222176A1
• Time in Patent Office: 564 Days
• CPC Class Codes: B32B 15/04 comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a bituminous or tarry layer B32B11/08; next to a water-setting substance layer B32B13/06; next to a glass layer B32B17/061; next to a cellulosic plastic layer B32B23/042
• CPC Class Codes: B32B 17/06 comprising glass as the main or only constituent of a layer, next to another layer of a specific material
• CPC Class Codes: B32B 2315/08 Glass
• CPC Class Codes: B32B 2457/202 LCD, i.e. liquid crystal displays
• CPC Class Codes: B32B 2457/204 Plasma displays
• CPC Class Codes: B32B 2457/206 Organic displays, e.g. OLED
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 43/00 Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
• CPC Class Codes: B32B 43/006 Delaminating
• CPC Class Codes: B65H 2301/51122 peeling layer of material
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/68386 Separation by peeling
• CPC Class Codes: Y10S 156/93 Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
• CPC Class Codes: Y10S 156/941 Means for delaminating semiconductive product
• CPC Class Codes: Y10T 156/1168 Gripping and pulling work apart during delaminating
• CPC Class Codes: Y10T 156/1978 Delaminating bending means

Abstract

A movable member is gripped in a delamination-start configuration, and the other-end side of a rib of a delamination member is pressed towards the other-end side of a flexible plate. The flexible plate then warps and deforms about the other end side of the flexible plate, which is supported by a support member, the flexible plate deforming along the direction in which delamination progresses. In concert with the delamination action, a reinforcing plate also warps and deforms along with the flexible plate, the reinforcing plate being vacuum-chucked to an air-permeable electroconductive sheet on the flexible plate, and the reinforcing plate is sequentially delaminated from a substrate 2 along the direction in which delamination progresses.

Claims

1. A peeling device for peeling a laminate comprising a first substrate and a second substrate, comprising:

a flexible plate having a counter-adsorption surface, and an adsorption surface which adsorbs and holds one of the first and second substrates such that the flexible plate has the counter-adsorption surface on an opposite side with respect to the adsorption surface;

a peeling member positioned to face the counter-adsorption surface of the flexible plate and having a convex surface facing the counter-adsorption surface such that one end portion of the peeling member is fixed to one end portion of the flexible plate, that a part of the convex surface is brought into contact with the counter-adsorption surface and that the other end portion of the peeling member is spaced from the other end portion of the counter-adsorption surface;

a supporting member supporting the other end portion of the flexible plate such that the supporting member is supporting the flexible plate in a cantilever manner; and

a movable member which moves the other end portion of the peeling member toward the other end portion of the counter-adsorption surface of the flexible plate such that the flexible plate is subjected to bending deformation along a peeling proceeding direction with the other end portion of the flexible plate supported by the supporting member as a fulcrum and sequentially peels off the one of the first and second substrates at an interface between the first substrate and the second substrate along the peeling proceeding direction from the one end portion toward the other end portion of the laminate by bending deformation of the one of the first substrate and the second substrate.

2. The peeling device according to claim 1, wherein the convex surface of the peeling member has an arc-shaped surface having a constant or continuously changing curvature radius along the peeling proceeding direction.

3. The peeling device according to claim 2, wherein the peeling member comprises a plurality of ribs fixed to the one end portion of the flexible plate.

4. The peeling device according to claim 1, wherein the peeling member has a close-contact member on the convex surface of the peeling member.

5. The peeling device according to claim 4, wherein the close-contact member is a sheet-shaped adsorption member or pressure-sensitive adhesive member.

6. The peeling device according to claim 4, wherein the close-contact member includes a plurality of fitting portions configured to be fitted to a plurality of to-be-fitted portions formed along the counter-adsorption surface of the flexible plate.

7. The peeling device according to claim 1, comprising:

a holding member which holds the other substrate of the first substrate and the second substrate; and

a sliding member which slides the holding member in a direction parallel to the other substrate.

8. The peeling device according to claim 7, further comprising:

a base on which the supporting member is positioned,

wherein the sliding member is positioned between the base and the holding member.

9. The peeling device according to claim 1, wherein the peeling member comprises a plurality of ribs fixed to the one end portion of the flexible plate.

10. The peeling device according to claim 9, wherein the plurality of ribs is formed such that each of the ribs has a plate shape.

11. The peeling device according to claim 10, wherein the plurality of ribs is fixed to the one end portion of the flexible plate by a plurality of bolts.

12. The peeling device according to claim 1, wherein the convex surface of the peeling member has an arc-shaped surface having a constant curvature radius along the peeling proceeding direction.

13. The peeling device according to claim 1, wherein the convex surface of the peeling member has an arc-shaped surface having a continuously changing curvature radius along the peeling proceeding direction.

14. The peeling device according to claim 1, wherein the movable member is configured to move the other end portion of the peeling member toward the other end portion of the counter-adsorption surface of the flexible plate by application of manual power such that the flexible plate is subjected to bending deformation along the peeling proceeding direction with the other end portion of the flexible plate supported by the supporting member as the fulcrum.

15. The peeling device according to claim 1, wherein the movable member comprises a handle attached to the one end portion of the peeling member and a handle attached to the other end portion of the peeling member and is configured to move the other end portion of the peeling member toward the other end portion of the counter-adsorption surface of the flexible plate by application of manual power such that the flexible plate is subjected to bending deformation along the peeling proceeding direction with the other end portion of the flexible plate supported by the supporting member as the fulcrum.

16. A peeling method for peeling a laminate, comprising:

adsorbing one of the first and second substrates onto an adsorption surface of a flexible plate;

positioning a peeling member having a convex surface such that the convex surface of the peeling member faces a counter-adsorption surface of the flexible plate on an opposite side with respect to the adsorption surface, that one end portion of the peeling member is fixed to one end portion of the flexible plate, that a part of the convex surface is in contact with the counter-adsorption surface of the flexible plate and that the other end portion of the peeling member is spaced from the other end portion of the counter-adsorption surface of the flexible plate; and

moving the other end portion of the peeling member toward the other end portion of the counter-adsorption surface by a movable member such that the flexible plate is subjected to bending deformation along a peeling proceeding direction with the other end portion of the flexible plate supported by a supporting member as a fulcrum and sequentially peels off the one of the first and second substrates at an interface between the first substrate and the second substrate along the peeling proceeding direction from the one end portion toward the other end portion of the laminate by bending deformation of the one of the first substrate and the second substrate,

wherein the supporting member supports the other end portion of the flexible plate such that the supporting member is supporting the flexible plate in a cantilever manner, and the movable member moves the other end portion of the peeling member toward the other end portion of the counter-adsorption surface.

17. The peeling method according to claim 16, wherein the convex surface of the peeling member is an arc-shaped surface having a constant or continuously changing curvature radius along the peeling proceeding direction, and the flexible plate is subjected to the bending deformation while being brought into contact with the arc-shaped surface of the peeling member.

18. The peeling method according to claim 16, wherein the peeling member has a close-contact member on the convex surface of the peeling member, and the flexible plate is subjected to the bending deformation while being closely contacted with the close-contact member.

19. The peeling method according to claim 16, wherein the other substrate of the first substrate and the second substrate is peeled off while sliding in a direction parallel to the other substrate.

20. A method for manufacturing an electronic device, comprising:

forming a functional layer on an exposed surface of a first substrate with respect to a laminate comprising the first substrate and a second substrate; and

separating the second substrate from the first substrate having the functional layer formed thereon,

wherein the separating comprises adsorbing one of the first and second substrates onto an adsorption surface of a flexible plate, positioning a peeling member having a convex surface such that the convex surface of the peeling member faces a counter-adsorption surface of the flexible plate on an opposite side with respect to the adsorption surface, that one end portion of the peeling member is fixed to one end portion of the flexible plate, that a part of the convex surface is in contact with the counter-adsorption surface of the flexible plate and that the other end portion of the peeling member is spaced from the other end portion of the counter-adsorption surface of the flexible plate, and moving the other end portion of the peeling member toward the other end portion of the counter-adsorption surface by a movable member such that the flexible plate is subjected to bending deformation along a peeling proceeding direction with the other end portion of the flexible plate supported by a supporting member as a fulcrum and sequentially peels off the one of the first and second substrates at an interface between the first substrate and the second substrate along the peeling proceeding direction from the one end portion toward the other end portion of the laminate by bending deformation of the one of the first substrate and the second substrate, the supporting member supports the other end portion of the flexible plate such that the supporting member is supporting the flexible plate in a cantilever manner, and the movable member moves the other end portion of the peeling member toward the other end portion of the counter-adsorption surface.