Per-pixel dark reference bolometer

• US 10,451,487 B1
• Filed: 08/23/2018
• Issued: 10/22/2019
• Est. Priority Date: 08/23/2018
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Kennedy, Adam M., Gordon, Eli E., Beuville, Eric J., Boesch, Ryan Paul, Hamers, Jeffrey K.
• Primary Examiner(s): Green, Yara B
• Application Number:
  US16/110,367
• Time in Patent Office: 425 Days
• Field of Search: 2503381
• CPC Class Codes: G01J 2005/0077 Imaging
• CPC Class Codes: G01J 2005/202 Arrays
• CPC Class Codes: G01J 5/06 Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity for adjusting of solid angle of collected radiation G01J5/07; means for wavelength selection G01J5/0801
• CPC Class Codes: G01J 5/20 using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
• CPC Class Codes: G01J 5/52 using comparison with reference sources, e.g. disappearing-filament pyrometer
• CPC Class Codes: G01J 5/80 Calibration using comparison with reference sources G01J5/52
• CPC Class Codes: H04N 25/63 applied to dark current
• CPC Class Codes: H04N 25/633 by using optical black pixels
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20

Abstract

Microbolometer arrays incorporating per-pixel dark reference structures for non-uniformity correction. In one example a thermal imager includes a device substrate, a microbolometer array disposed on the device substrate and including a plurality of detector elements arranged in a two-dimensional array, each detector element including an imaging microbolometer and a reference microbolometer, the imaging microbolometer being configured to receive electromagnetic radiation from a viewed scene and to produce an image signal in response to receiving the electromagnetic radiation, the image signal including a component produced due to thermal noise in the respective detector element, and the reference microbolometer being shielded from receiving the electromagnetic radiation and configured to produce a reference signal indicative of the thermal noise, wherein the thermal imaging device is configured to produce an image of the viewed scene based on a combination of the image signals and the reference signals from the plurality of detector elements.

Claims

1. A thermal imaging device comprising:

a read-out integrated circuit (ROIC) substrate; and

a microbolometer array disposed on the ROIC substrate and including a plurality of detector elements arranged in a two-dimensional array, each detector element including an imaging microbolometer and a reference microbolometer, the imaging microbolometer being configured to receive electromagnetic radiation from a viewed scene and to produce an image signal in response to receiving the electromagnetic radiation, the image signal including a component produced due to thermal noise in the respective detector element, and the reference microbolometer being shielded from receiving the electromagnetic radiation and configured to produce a reference signal indicative of the thermal noise, each detector element further including circuitry configured to subtract the reference signal from the image signal to produce a corrected image signal, the circuitry including a pair of complementary transistors connected in series between the reference microbolometer and the imaging microbolometer,

wherein the thermal imaging device is configured to produce an image of the viewed scene from the corrected image signals from the plurality of detector elements.

2. The thermal imaging device of claim 1 wherein the imaging microbolometer of each detector element includes a layer of thermally sensitive material suspended above the ROIC substrate, and wherein the reference microbolometer of each detector element includes a reference resistor made of the thermally sensitive material.

3. The thermal imaging device of claim 2 wherein the thermally sensitive material is vanadium oxide.

4. The thermal imaging device of claim 2 wherein the reference bolometer is configured with a resistance value equal to a resistance value of the layer of thermally sensitive material.

5. The thermal imaging device of claim 2 wherein the reference resistor is disposed on the ROIC substrate, and wherein each detector element further includes a layer of infrared reflecting material disposed over the reference resistor and configured to shield the reference microbolometer from receiving the electromagnetic radiation.

6. The thermal imaging device of claim 5 wherein the infrared reflecting material is aluminum.

7. The thermal imaging device of claim 1 wherein the electromagnetic radiation is infrared radiation having wavelengths in a range of 8-12 micrometers.

8. The thermal imaging device of claim 1 further comprising a ROIC implemented in the ROIC substrate and coupled to the microbolometer array, the ROIC being configured to process the image signals and the reference signals from the plurality of detector elements to produce the image of the viewed scene.

9. A thermal imaging method comprising:

receiving electromagnetic radiation from a viewed scene at an imaging microbolometer of each of a plurality of detector elements of a microbolometer array;

producing, from the imaging microbolometer included in each of the plurality of detector elements, an image signal from a combination of the received electromagnetic radiation and thermal noise in the respective detector element;

producing, from a reference microbolometer included in each of the plurality of detector elements, a reference signal based on the thermal noise, the reference microbolometer being shielded from receiving the electromagnetic radiation;

for each detector element, subtracting the reference signal from the image signal using a pair of complementary transistors connected in series between the reference microbolometer and the imaging microbolometer to produce a corrected image signal; and

producing an image of the viewed scene based on the corrected image signals from the plurality of detector elements.

10. The thermal imaging method of claim 9 wherein receiving the electromagnetic radiation from the viewed scene includes receiving infrared radiation having wavelengths in a range of 8-12 micrometers.

11. A thermal imaging device comprising:

a read-out integrated circuit (ROIC) substrate;

a microbolometer array disposed on the ROIC substrate and including a two-dimensional array of detector elements, each detector element including;

a reference resistor formed on a first surface of the ROIC substrate, the reference resistor being formed of a thermally sensitive material and configured to produce a reference signal representative of thermal noise in the detector element,

a reflector disposed over the reference resistor and the first surface of the ROIC substrate, the reflector being formed of an infrared reflecting material and configured to shield the reference resistor from receiving electromagnetic radiation from a scene viewed by the microbolometer array, and

an imaging microbolometer suspended above the reflector and thermally isolated from the ROIC substrate by a pair of thermal isolation legs, the imaging microbolometer including a layer of the thermally sensitive material supported by a support layer, and being configured to receive the electromagnetic radiation from the viewed scene and to produce an image signal based on the received electromagnetic radiation and the thermal noise in the detector element; and

circuitry formed in the ROIC substrate and coupled to the microbolometer array and configured to, for each detector element, subtract the reference signal from the image signal to produce a corrected image signal, and to produce an image of the viewed scene based on the corrected image signals from the plurality of detector elements, the circuitry including a pair of complementary transistors connected in series between the reference microbolometer and the imaging microbolometer.

12. The thermal imaging device of claim 11 wherein the thermally sensitive material is vanadium oxide.

13. The thermal imaging device of claim 11 further comprising a lid wafer coupled to the ROIC substrate and configured to provide a cavity over the microbolometer array, the lid wafer including a region that is optically transparent to the electromagnetic radiation to allow the electromagnetic radiation to be received at the microbolometer array.

14. The thermal imaging device of claim 11 wherein the electromagnetic radiation is infrared radiation having wavelengths in a range of 8-12 micrometers.

15. The thermal imaging device of claim 11 wherein the infrared reflecting material is aluminum.

16. The thermal imaging device of claim 11 wherein the reference resistor has a resistance value equal to a resistance value of the layer of the thermally sensitive material in the imaging microbolometer.

17. The thermal imaging device of claim 11 wherein the support layer is silicon nitride.

18. The thermal imaging device of claim 11 wherein the support layer includes a plurality of holes.