Sensor package
First Claim
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1. A sensor package comprising:
- a package comprising a bottomed tubular casing and a plurality of leads substantially parallel to each other, each lead of the plurality of leads piercing the bottomed tubular casing; and
a MEMS chip comprising;
one thermopile that measures a temperature difference in a predetermined direction;
or a plurality of thermopiles each of which measures the temperature difference in the predetermined direction,wherein the MEMS chip is disposed in an inner bottom surface of the bottomed tubular casing of the package such that a measurement direction of the temperature difference measured with the one thermopile or the plurality of thermopiles is substantially orthogonal to a longitudinal direction of each lead of the plurality of leads of the package.
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Abstract
Provided is a sensor package that measures an internal temperature of a measurement object. A sensor package includes: a package including a bottomed tubular casing and plural leads substantially parallel to each other, each of the leads piercing the bottomed tubular casing; and a MEMS chip including at least one thermopile that measures a temperature difference in an identical direction. The MEMS chip is disposed in an inner bottom surface of the bottomed tubular casing of the package in a posture in which a measurement direction of the temperature difference measured with the thermopile is substantially orthogonal to a longitudinal direction of each lead.
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Citations
8 Claims
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1. A sensor package comprising:
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a package comprising a bottomed tubular casing and a plurality of leads substantially parallel to each other, each lead of the plurality of leads piercing the bottomed tubular casing; and a MEMS chip comprising;
one thermopile that measures a temperature difference in a predetermined direction;
or a plurality of thermopiles each of which measures the temperature difference in the predetermined direction,wherein the MEMS chip is disposed in an inner bottom surface of the bottomed tubular casing of the package such that a measurement direction of the temperature difference measured with the one thermopile or the plurality of thermopiles is substantially orthogonal to a longitudinal direction of each lead of the plurality of leads of the package. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A sensor package comprising:
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a bottomed tubular package comprising a plurality of leads; and a MEMS chip comprising;
one thermopile that measures a temperature difference in a predetermined direction;
or a plurality of thermopiles each of which measures the temperature difference in the predetermined direction,wherein the MEMS chip is disposed in an inner bottom surface of the bottomed tubular package such that a measurement direction of the temperature difference measured with the one thermopile or the plurality of thermopiles becomes a direction in which two portions in an inside face of the bottomed tubular package are connected to each other, and an amount of temperature rise caused by inflow of heat from the plurality of leads in the two portions is less than an amount of temperature rise in other portions.
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Specification