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Sensor package

  • US 10,451,490 B2
  • Filed: 02/24/2016
  • Issued: 10/22/2019
  • Est. Priority Date: 03/12/2015
  • Status: Active Grant
First Claim
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1. A sensor package comprising:

  • a package comprising a bottomed tubular casing and a plurality of leads substantially parallel to each other, each lead of the plurality of leads piercing the bottomed tubular casing; and

    a MEMS chip comprising;

    one thermopile that measures a temperature difference in a predetermined direction;

    or a plurality of thermopiles each of which measures the temperature difference in the predetermined direction,wherein the MEMS chip is disposed in an inner bottom surface of the bottomed tubular casing of the package such that a measurement direction of the temperature difference measured with the one thermopile or the plurality of thermopiles is substantially orthogonal to a longitudinal direction of each lead of the plurality of leads of the package.

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