Sensor with symmetrically embedded sensor elements

• US 10,451,646 B2
• Filed: 01/26/2016
• Issued: 10/22/2019
• Est. Priority Date: 01/28/2015
• Status: Active Grant

• Current Assignee: Continental Teves AG & Co. OHG (Continental AG)
• Original Assignee: Continental Teves AG & Co. OHG (Continental AG)
• Inventors: Raukopf, Svenja, Schillinger, Jakob, Schulmeister, Michael
• Primary Examiner(s): Macchiarolo, Peter J
• Assistant Examiner(s): Campbell, Irving A
• Application Number:
  US15/540,791
• Publication Number:
  US 20180011124A1
• Time in Patent Office: 1,365 Days
• Field of Search: 7351439
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0054 between other parts not provided for in B81B7/0048 - B81B7/0051
• CPC Class Codes: G01D 11/245 Housings for sensors
• CPC Class Codes: G01D 5/165 by relative movement of a point of contact or actuation and a resistive track
• CPC Class Codes: G01P 3/44 for measuring angular speed G01P3/56 takes precedence
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item

Abstract

A sensor for detecting a physical variable, including: —a sensor element for outputting an electrical signal dependent on the physical variable, —a substrate carrying the sensor element, —a printed circuit board, conducting the electrical signal, on the substrate, and —an embedding compound, in which the sensor element is completely embedded and the printed circuit board is at least partly embedded, —wherein at least one compensation element is embodied in the embedding compound, by which compensation element a mechanical stress caused by an element of the sensor at least partly embedded in the embedding compound is counteracted.

Claims

1. A sensor for detecting a physical variable, comprising:

a sensor element for outputting an electrical signal dependent on the physical variable,

a substrate supporting the sensor element,

a conductor track conducting the electrical signal on the substrate, and

an embedding compound, in which the sensor element is completely embedded and the conductor track is at least partially embedded,

wherein at least one compensation element is at least partially embedded in the embedding compound, by which compensation element a mechanical stress induced by an element of the sensor at least partially embedded in the embedding compound is counteracted, the at least one compensation element comprising an electrical component which differs from the sensor element.

2. The sensor as claimed in claim 1,

wherein the compensation element and the element of the sensor which causes the mechanical stress are arranged symmetrically.

3. The sensor as claimed in claim 2,

wherein the compensation element is made of a different material from the embedding compound.

4. The sensor as claimed in claim 1,

wherein the compensation element is made of a different material from the embedding compound.

5. The sensor as claimed in claim 1,

wherein the element of the sensor at least partially embedded in the embedding compound comprises the sensor element.

6. The sensor as claimed in claim 1,

wherein the electrical component that differs from the sensor element is a filter element or a signal processing circuit.

7. A control device for a vehicle for controlling a behavior of the vehicle based on a detected physical variable, comprising a sensor as claimed in claim 1, for detecting the physical variable.

8. The sensor as claimed in claim 1,

wherein an electrical contact between the conductor track and the sensor element is different from an electrical contact of the compensation element with the conductor track or with another conductor track.

9. A sensor for detecting a physical variable, comprising:

a sensor element for outputting an electrical signal dependent on the physical variable,

a substrate supporting the sensor element,

a conductor track conducting the electrical signal on the substrate, and

an embedding compound, in which the sensor element is completely embedded and the conductor track is at least partially embedded,

wherein at least one compensation element is provided, by which compensation element a mechanical stress induced by an element of the sensor at least partially embedded in the embedding compound is counteracted, and

wherein an electrical contact between the conductor track and the sensor element is different from an electrical contact of the compensation element with the conductor track or with another conductor track.

10. The sensor as claimed in claim 9,

wherein the electrical contacts differ in their size.

11. The sensor as claimed in claim 10,

wherein the size difference is designed in such a way that the mechanical stress is further reduced.