Method of installing electronic component, display device and display system

• US 10,451,934 B2
• Filed: 09/27/2017
• Issued: 10/22/2019
• Est. Priority Date: 09/28/2016
• Status: Active Grant

• Current Assignee: LG Display Co., Ltd.
• Original Assignee: LG Display Co., Ltd.
• Inventors: Furuta, Kaoru
• Primary Examiner(s): Nguyen, Hoa C
• Assistant Examiner(s): DePew, Keith
• Application Number:
  US15/717,760
• Publication Number:
  US 20180088388A1
• Time in Patent Office: 755 Days
• CPC Class Codes: G02F 1/13336 Combining plural substrates to produce large-area displays, e.g. tiled displays
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2924/15173 in a single layer of the multilayer substrate
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 3/3463 Solder compositions in relation to features of the printed circuit board or the mounting process

Abstract

A display device, a display system, and a method of installing an electronic component are disclosed. In one embodiment, the electronic component is junctioned to a display panel of the display device using an auto-agglutination solder. The installation method includes positioning the electronic component having an electronic component side line connection part at a substrate stack that includes two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line; forming an auto-agglutination solder between the electronic component side line connection part and the substrate side line connection part; and pressurizing the electronic component side line connection part and the substrate side line connection part by heating-up the auto-agglutination solder.

Claims

1. A display device, comprising:

a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line;

an electronic component including an electronic component side line connection part, the electronic component side line connection part facing a vertical end surface of the substrate stack; and

a junction part between the substrate stack and the electronic component that electrically joins the vertical end surface of the substrate stack and the electronic component,

the junction part including a solder junction part and a resin junction part spaced apart from the solder junction part, the solder junction part being between the substrate side line connection part and the electronic component side line connection part, and the resin junction part being between the vertical end surface of one of the two substrates of the substrate stack and a surface of the electronic component spaced apart from the electronic component side line connection part.

2. The display device according to claim 1, wherein the substrate side line connection part is connected to the end of the line and formed along the vertical end surface, and the substrate side line connection part is a connection pad formed of a conductive material.

3. The display device according to claim 1, wherein the substrate side line connection part is a portion of the end of the line that is exposed in a space between the two substrates.

4. The display device according to claim 1, wherein the electronic component side line connection part has a vertical length that is larger than the substrate side line connection part.

5. The display device according to claim 1, wherein the solder junction part has a thickness that is equal to less than about 20 μ

m.

6. The display device according to claim 1, wherein a distance between adjacent substrate side line connection parts has a range of 10 to 100 μ

m.

7. The display device according to claim 1, wherein at least one of the substrate side line connection part and the electronic component side line connection part includes tin (Sn), lead (Pb), zinc (Zn), silver (Ag), or copper (Cu).

12. The display device according to claim 1, wherein the solder junction part and the resin junction part are arranged in an alternating manner within the junction part.

8. A display system, comprising:

a first display device;

a second display device adjacent to the first display device along a first direction; and

a third display device adjacent to the first display device along a second direction,

wherein at least one of the first to third display devices includes;

a substrate stack including two substrates, a line between the two substrates, and a substrate side line connection part at an end of the line;

an electronic component including an electronic component side line connection part, the electronic component side line connection part facing a vertical end surface of the substrate stack; and

a junction part between the substrate stack and the electronic component that electrically joins the vertical end surface of the substrate stack and the electronic component,

the junction part including a solder junction part and a resin junction part spaced apart from the solder junction part, the solder junction part being between the substrate side line connection part and the electronic component side line connection part, and the resin junction part being between the vertical end surface of one of the two substrates of the substrate stack and a surface of the electronic component spaced apart from the electronic component side line connection part.

9. The display system according to claim 8, wherein the solder junction part and the resin junction part are arranged in an alternating manner within the junction part.

10. The display system according to claim 9, wherein the substrate side line connection part is connected to the end of the line and formed along the vertical end surface, and the substrate side line connection part is a connection pad formed of a conductive material.

11. The display system according to claim 9, wherein the substrate side line connection part is a portion of the end of the line that is exposed in a space between the two substrates.