Resin composition, method for manufacturing semiconductor element using the same, and semiconductor device
First Claim
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1. A resin composition, comprising:
- (A1) an alkali-soluble resin having a structural unit represented by general formula (1);
(A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and
(B) a photosensitizer, whereinan amount of the resin (A2) is 350 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1),
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Abstract
Provided is a resin composition including: (A1) an alkali-soluble resin having a specific structural unit; (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, in which the amount of the resin (A2) is 310 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1).
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Citations
14 Claims
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1. A resin composition, comprising:
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(A1) an alkali-soluble resin having a structural unit represented by general formula (1); (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, wherein an amount of the resin (A2) is 350 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1), - View Dependent Claims (2, 3, 4)
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5. A resin composition, comprising:
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(A1) an alkali-soluble resin having a structural unit represented by general formula (1); (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, wherein an amount of the resin (A2) is 350 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1), wherein R1 is a hydrogen atom or a C1-5 alkyl group;
R2 is a hydrogen atom or a C1-6 alkyl group;
a is an integer of 0 to 4;
b is an integer of 1 to 3; and
a+b is an integer of 1 to 5, andwherein the resin composition is soluble in a solution having a weight ratio of dimethyl-sulfoxide/monoethanolamine=3/7 after heat-treated at 250°
C. for 1 hour. - View Dependent Claims (6, 7, 8)
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9. A method for manufacturing a semiconductor element, the method comprising the steps of:
(1) forming a pattern of a resin composition on a substrate, the resin composition comprising; (A1) an alkali-soluble resin having a structural unit represented by general formula (1), (A2) at least one resin selected from the group consisting of polyimides, polybenzoxazoles, polyamideimides, precursors thereof, and copolymers thereof, the resin having a substituent that reacts with a reactive group of the alkali-soluble resin; and (B) a photosensitizer, wherein an amount of the resin (A2) is 350 to 2,000 parts by weight with respect to 100 parts by weight of the resin (A1), - View Dependent Claims (10, 11, 12, 13, 14)
Specification