Interfaces and die packages, and appartuses including the same
First Claim
1. An apparatus, comprising:
- a die package including multiple groups of circuits;
an interface configured to divide a channel between the die package and a controller into multiple channels in response to an external control signal, with at least one channel corresponding to each circuit of the multiple groups of circuits;
wherein the interface device is further configured to divide the channel into multiple input/output (IO) channels; and
wherein one of the multiple JO channels is to be coupled between a first IO pad of the controller and IO pads on each of a first group of the multiple groups of circuits that are disposed in a first portion of the die package, and another one of the multiple IO channels is to be coupled between a second IO pad of the controller and IO pads on each of a second group of the multiple groups of circuits that are disposed in a second portion of the die package.
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Accused Products
Abstract
A memory device includes a memory die package including a plurality of memory dies, an interface device including an interface circuit, and a memory controller configured to control the interface with control data received from at least one of the plurality of memory dies. The interface device of the memory device is configured to divide and multiplex an IO channel between the memory die package and the memory controller into more than one channel using the control data receive from the at least one of the plurality of memory dies. The interface device for a memory device includes a control input buffer configured to receive an enable signal through a control pad, a first input buffer configured to receive a first data through a first IO pad in response to a first state of the enable signal, and a second input buffer configured to receive a second data through a second IO pad in response to a second state of the enable signal. The interface device further includes an input multiplexer configured to multiplex the first data and the second data to provide an input data.
15 Citations
14 Claims
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1. An apparatus, comprising:
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a die package including multiple groups of circuits; an interface configured to divide a channel between the die package and a controller into multiple channels in response to an external control signal, with at least one channel corresponding to each circuit of the multiple groups of circuits; wherein the interface device is further configured to divide the channel into multiple input/output (IO) channels; and wherein one of the multiple JO channels is to be coupled between a first IO pad of the controller and IO pads on each of a first group of the multiple groups of circuits that are disposed in a first portion of the die package, and another one of the multiple IO channels is to be coupled between a second IO pad of the controller and IO pads on each of a second group of the multiple groups of circuits that are disposed in a second portion of the die package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A memory device, comprising:
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multiple groups of circuit devices each containing at least one memory device; and an interface device to; receive first data through a first input/output (IO) on the interface device from a first group of the circuit devices, receive second data through a second IO pad on the interface device from a second group of the circuit devices, and an input multiplexer configured to multiplex the first data and the second data to provide integrated data in response to an enable signal. - View Dependent Claims (11, 12, 13, 14)
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Specification