Power converter and power converter for railroad vehicle

• US 10,453,770 B2
• Filed: 10/25/2018
• Issued: 10/22/2019
• Est. Priority Date: 11/15/2017
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Takizawa, Masamitsu, Kobayashi, Nobuyuki, Mori, Yoshio, Nakamichi, So, Matsui, Kohei
• Primary Examiner(s): Smith, Courtney L
• Application Number:
  US16/170,439
• Publication Number:
  US 20190148259A1
• Time in Patent Office: 362 Days
• Field of Search: None
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H02M 5/4585 having a rectifier with controlled elements
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/487 Neutral point clamped inverters
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence
• CPC Class Codes: H05K 7/20863 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20881 Liquid coolant with phase change
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20918 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
• CPC Class Codes: H05K 7/20936 Liquid coolant with phase change

Abstract

In each of a plurality of semiconductor element groups of a power converter, a second semiconductor switching element and a third semiconductor switching element are shifted from each other in a second direction such that at least a portion of fins with which the second semiconductor switching element overlaps as viewed in a direction orthogonal to surfaces of coolers is different from fins with which the third semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers.

Claims

1. A power converter comprising:

a plurality of semiconductor element groups, each including a first semiconductor switching element, a second semiconductor switching element, a third semiconductor switching element, and a fourth semiconductor switching element, connected in series to each other in this order, and being configured such that each of the second semiconductor switching element and the third semiconductor switching element generates larger amount of heat than the first semiconductor switching element and the fourth semiconductor switching element; and

coolers on which the plurality of semiconductor element groups is placed, including a plurality of plate-shaped fins that extends along a first direction, which is a direction in which cooling air flows, wherein

the plurality of plate-shaped fins is disposed side by side along a second direction orthogonal to the first direction, and

the plurality of semiconductor element groups is disposed side by side along the second direction so as to overlap with the fins on surfaces of the coolers opposite to surfaces on which the fins are provided, and in each of the plurality of semiconductor element groups, the second semiconductor switching element and the third semiconductor switching element are shifted from each other in the second direction such that at least a portion of the fins with which the second semiconductor switching element overlaps as viewed in a direction orthogonal to the surfaces of the coolers is different from the fins with which the third semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers.

2. The power converter according to claim 1, wherein in each of the plurality of semiconductor element groups, the second semiconductor switching element and one of the first semiconductor switching element and the fourth semiconductor switching element are disposed in a first row along the first direction, and the third semiconductor switching element and the other of the first semiconductor switching element and the fourth semiconductor switching element are disposed in a second row along the first direction.

3. The power converter according to claim 2, wherein

each of the plurality of semiconductor element groups includes a first diode element and a second diode element provided between a connection point between the first semiconductor switching element and the second semiconductor switching element and a connection point between the third semiconductor switching element and the fourth semiconductor switching element, and connected in series to each other, and

in each of the plurality of semiconductor element groups, the second semiconductor switching element, one of the first semiconductor switching element and the fourth semiconductor switching element, and the first diode element are disposed in the first row along the first direction, and the third semiconductor switching element, the other of the first semiconductor switching element and the fourth semiconductor switching element, and the second diode element are disposed in the second row along the first direction.

4. The power converter according to claim 3, further comprising a power converter main body including the plurality of semiconductor element groups, wherein

the power converter main body is configured for a railroad vehicle,

the plurality of plate-shaped fins of the coolers extends along the first direction, which is a traveling direction of the railroad vehicle, and

in each of the plurality of semiconductor element groups, the second semiconductor switching element is disposed between the first diode element and one of the first semiconductor switching element and the fourth semiconductor switching element in the first direction, and the third semiconductor switching element is disposed between the second diode element and the other of the first semiconductor switching element and the fourth semiconductor switching element in the first direction.

5. The power converter according to claim 1, wherein

the plurality of semiconductor element groups includes a first semiconductor element group forming a converter that converts an alternating current to a direct current and a second semiconductor element group forming an inverter that converts a direct current to an alternating current, and

at least in the first semiconductor element group, the second semiconductor switching element and the third semiconductor switching element are shifted from each other in the second direction such that at least the portion of the fins with which the second semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers is different from the fins with which the third semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers.

6. The power converter according to claim 1, wherein

the coolers each include a base to which the plurality of plate-shaped fins is attached,

the power converter further comprising

a plurality of fasteners by which each of the first semiconductor switching element, the second semiconductor switching element, the third semiconductor switching element, and the fourth semiconductor switching element is attached to each of the coolers;

and

a heat pipe provided inside the base of each of the coolers and extending along the first direction, wherein

the plurality of fasteners is disposed side by side along the first direction, which is a direction in which the heat pipe extends.

7. The power converter according to claim 6, wherein

the first semiconductor switching element, the second semiconductor switching element, the third semiconductor switching element, and the fourth semiconductor switching element are respectively housed in modules each having a substantially rectangular shape as viewed in the direction orthogonal to the surfaces of the coolers, and

the fasteners are provided along two sides of each of the modules in the first direction.

8. The power converter according to claim 1, wherein in each of the plurality of semiconductor element groups, the second semiconductor switching element and the third semiconductor switching element are placed on the surface of each of the coolers such that the fins with which the second semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers are different from the fins with which the third semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers.

11. The power converter according to claim 1, wherein

the second semiconductor switching element and the third semiconductor switching element are disposed between the first semiconductor switching element and the fourth semiconductor switching element.

12. The power converter according to claim 1, wherein

each of the plurality of semiconductor element groups further includes a capacitor connected between one end of the first semiconductor switching element and the other end of the fourth semiconductor switching element in parallel.

9. A power converter for a railroad vehicle, comprising:

a plurality of semiconductor element groups each including a first semiconductor switching element, a second semiconductor switching element, a third semiconductor switching element, and a fourth semiconductor switching element connected in series to each other in this order, and being configured such that each of the second semiconductor switching element and the third semiconductor switching element generates larger amount of heat than the first semiconductor switching element and the fourth semiconductor switching element; and

coolers on which the plurality of semiconductor element groups is placed, including a plurality of plate-shaped fins that extends along a first direction, which is a traveling direction of the railroad vehicle, wherein

the plurality of plate-shaped fins is disposed side by side along a second direction orthogonal to the first direction, and

the plurality of semiconductor element groups is disposed side by side along the second direction so as to overlap with the fins on surfaces of the coolers opposite to surfaces on which the fins are provided, and in each of the plurality of semiconductor element groups, the second semiconductor switching element and the third semiconductor switching element are shifted from each other in the second direction such that at least a portion of the fins with which the second semiconductor switching element overlaps as viewed in a direction orthogonal to the surfaces of the coolers is different from the fins with which the third semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers.

10. A power converter comprising:

a plurality of semiconductor element groups, each including a first semiconductor switching element, a second semiconductor switching element, a third semiconductor switching element, and a fourth semiconductor switching element, connected in series to each other in this order;

coolers on which the plurality of semiconductor element groups is placed, including a plurality of plate-shaped fins that extends along a first direction, which is a direction in which cooling air flows;

a plurality of fasteners by which each of the first semiconductor switching element, the second semiconductor switching element, the third semiconductor switching element, and the fourth semiconductor switching element is attached to each of the coolers; and

a heat pipe extending along the first direction, wherein

the plurality of plate-shaped fins is disposed side by side along a second direction orthogonal to the first direction,

the plurality of semiconductor element groups is disposed side by side along the second direction so as to overlap with the plurality of plate-shaped fins on surfaces of the coolers opposite to surfaces on which the plurality of plate-shaped fins is provided, and in each of the plurality of semiconductor element groups, the second semiconductor switching element and the third semiconductor switching element are shifted from each other in the second direction such that at least a portion of the plurality of plate-shaped fins with which the second semiconductor switching element overlaps as viewed in a direction orthogonal to the surfaces of the coolers is different from the plurality of plate-shaped fins with which the third semiconductor switching element overlaps as viewed in the direction orthogonal to the surfaces of the coolers,

each of the coolers includes a base to which the plurality of plate-shaped fins is attached, and the heat pipe is provided inside the base of each of the coolers, and

the plurality of fasteners is disposed side by side along the first direction, which is a direction in which the heat pipe extends.