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Package with roughened encapsulated surface for promoting adhesion

  • US 10,453,771 B2
  • Filed: 09/20/2017
  • Issued: 10/22/2019
  • Est. Priority Date: 09/21/2016
  • Status: Active Grant
First Claim
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1. A package, comprising:

  • at least one electronic chip;

    a first heat removal body thermally coupled to a first main surface of the at least one electronic chip and configured for removing thermal energy from the at least one electronic chip;

    a second heat removal body thermally coupled to a second main surface of the at least one electronic chip or of at least one further electronic chip and configured for removing thermal energy from the at least one electronic chip or of the at least one further electronic chip;

    an encapsulant encapsulating at least part of the at least one electronic chip, and part of the first heat removal body;

    wherein at least part of a surface of the first heat removal body is roughened,wherein the encapsulant encapsulates part of the second heat removal body; and

    wherein at least part of a surface of the second heat removal body is roughened,wherein at least one of the first heat removal body and the second heat removal body comprises an electrically insulating layer having a first main surface covered by a first electrically conductive layer,wherein at least part of the electrically conductive layer of at least one of the first heat removal body and the second heat removal body being in direct contact with the encapsulant is roughened.

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