Devices for absorbing energy from electronic components
First Claim
Patent Images
1. An assembly comprising:
- an electronic component on a substrate;
a board level shield including a fence coupled to the substrate and surrounding the electronic component; and
a device for absorbing energy from an electronic component, the device comprising;
a low melting alloy layer including a first side and a second side opposing the first side, the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture,a first coating layer substantially covering the first side of the low melting alloy layer and/or adjacent a top portion of the device,a second coating layer substantially covering the second side of the low melting alloy layer and/or positionable adjacent the electronic component, andat least one thermally conductive layer coupled between the low melting alloy layer and one of the first or second coating layer;
wherein the device is a lid of the board level shield when coupled to the fence and positioned adjacent and over the electronic component, such that one or more portions of the fence pierce through, penetrate through, and/or pass the second coating layer and couple with at least another portion of the device; and
wherein;
the low melting alloy layer is a first low melting alloy layer, and the device further comprises a second low melting alloy layer coupled to the thermally conductive layer;
orthe thermally conductive layer is a first thermally conductive layer, and the device further comprises at least a second thermally conductive layer formed of graphite.
1 Assignment
0 Petitions
Accused Products
Abstract
A device for absorbing energy from an electronic component includes a low melting alloy layer including a first side and a second side opposing the first side, and coating layers substantially covering the first side and the second side of the low melting alloy layer. In some embodiments, the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture. Other example devices are also disclosed.
-
Citations
20 Claims
-
1. An assembly comprising:
-
an electronic component on a substrate; a board level shield including a fence coupled to the substrate and surrounding the electronic component; and a device for absorbing energy from an electronic component, the device comprising; a low melting alloy layer including a first side and a second side opposing the first side, the low melting alloy layer includes a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture, a first coating layer substantially covering the first side of the low melting alloy layer and/or adjacent a top portion of the device, a second coating layer substantially covering the second side of the low melting alloy layer and/or positionable adjacent the electronic component, and at least one thermally conductive layer coupled between the low melting alloy layer and one of the first or second coating layer; wherein the device is a lid of the board level shield when coupled to the fence and positioned adjacent and over the electronic component, such that one or more portions of the fence pierce through, penetrate through, and/or pass the second coating layer and couple with at least another portion of the device; and wherein; the low melting alloy layer is a first low melting alloy layer, and the device further comprises a second low melting alloy layer coupled to the thermally conductive layer;
orthe thermally conductive layer is a first thermally conductive layer, and the device further comprises at least a second thermally conductive layer formed of graphite. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. A device for absorbing energy from an electronic component, the device comprising:
-
a first thermally conductive layer including a first side and a second side opposing the first side; two or more low melting alloy layers, one low melting alloy layer coupled to the first side of the first thermally conductive layer, another low melting alloy layer coupled to the second side of the first thermally conductive layer; two or more graphite layers, one graphite layer coupled to said one low melting alloy layer, another graphite layer coupled to said another low melting alloy layer; and two or more coating layers, one coating layer substantially covering one side of said one graphite layer, another coating layer substantially covering one side of said another graphite layer; wherein the device is configured to be attached to a fence of a board level shield that is coupled to a substrate and surrounding the electronic component, such that the device is operable a lid of the board level shield and one or more portions of the fence pierce through, pass, and/or penetrate at least one of the coating layers and couple to at least one of the graphite layers. - View Dependent Claims (14, 15, 16, 17, 18)
-
-
19. An assembly comprising:
-
an electronic component on a substrate; and a board level shield including a fence coupled to the substrate and surrounding the electronic component and a lid coupled to the fence, whereby the board level shield is operable for providing shielding of the electronic component; wherein the lid comprises; a thermally conductive layer, the thermally conductive layer including a polymer mixture and a plurality of low melting alloy particulates dispersed in the polymer mixture; a first coating layer; a second coating layer; a first graphite layer between the thermally conductive layer and the first coating layer, the first coating layer configured to substantially prevent graphite from flaking off the first graphite layer; a second graphite layer between the thermally conductive layer and the second coating layer, the second coating layer configured to substantially prevent graphite from flaking off the second graphite layer; wherein one or more portions of the fence pierce through, pass, and/or penetrate the second coating layer and couple to the second graphite layer, which thereby allows the second graphite layer to couple to a reference potential on the substrate via the one or more portions of the fence. - View Dependent Claims (20)
-
Specification