Thermally enhanced substrate

• US 10,453,774 B1
• Filed: 08/01/2018
• Issued: 10/22/2019
• Est. Priority Date: 08/01/2018
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Liu, Kai, Yang, Bin, Li, Xia
• Primary Examiner(s): Le, Dung A.
• Application Number:
  US16/051,528
• Time in Patent Office: 447 Days
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/0026 Multilayer LC-filter
• CPC Class Codes: H01F 27/08 Cooling heat-transfer elements F28F; Ventilating structural details of casings H01F27/02
• CPC Class Codes: H01L 2223/6672 for integrated passive components, e.g. semiconductor device with passive components only integrated circuits with passive components only per se H01L27/01
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/3732 Diamonds
• CPC Class Codes: H01L 23/3735 Laminates or multilayers, e.g. direct bond copper ceramic substrates
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 27/01 comprising only passive thin-film or thick-film elements formed on a common insulating substrate passive two-terminal components without a potential-jump or surface barrier for integrated circuits, details thereof and multistep manufacturing processes therefor H01L28/00

Abstract

Aspects generally relate to an integrated circuit including a glass substrate. On a surface of the glass substrate a thermally conductive insulating layer is formed. At least one metal layer is formed above the thermally conductive insulating layer, and a plurality of thermal bumps extend through the at least one metal layer and couple to the thermally conductive insulating layer to dissipate heat from the substrate.

Claims

1. An integrated circuit comprising:

a glass substrate;

a thermally conductive insulating layer formed on a surface of the glass substrate;

at least one metal layer formed above the thermally conductive insulating layer; and

a plurality of thermal bumps extending through the at least one metal layer and coupled to the thermally conductive insulating layer.

2. The integrated circuit of claim 1, wherein the thermally conductive insulating layer comprises a diamond layer.

3. The integrated circuit of claim 2, wherein forming the diamond layer comprises a chemical vapor disposition.

4. The integrated circuit of claim 1, wherein the thermally conductive insulating layer comprises aluminum nitride.

5. The integrated circuit of claim 1, wherein the thermally conductive insulating layer comprises boron nitride.

6. The integrated circuit of claim 1, wherein the thermally conductive insulating layer comprises zinc oxide.

7. The integrated circuit of claim 1, further comprising an inductor formed in the at least one metal layer.

8. The integrated circuit of claim 1, further comprising inductors and capacitors formed in the at least one metal layer, wherein the inductors and capacitors form a radio frequency (RF) filter.

9. The integrated circuit of claim 8, wherein the RF filter is used in a 5G device.

10. The integrated circuit of claim 1, further comprising a thermal enhancement ring formed on the thermally conductive insulating layer.

11. The integrated circuit of claim 10, wherein the thermal enhancement ring is copper.

12. The integrated circuit of claim 10, wherein at least one of the plurality of thermal bumps is coupled to the thermal enhancement ring.

13. A passive on glass device, comprising:

a glass substrate;

a thermally conductive insulating layer formed on a surface of the glass substrate;

a radio frequency (RF) filter formed in a plurality of metal layers formed on the thermally conductive insulating layer;

a plurality of thermal bumps extending through the plurality of metal layers and coupled to the thermally conductive insulating layer;

a circuit board with a ground plane, wherein at least one of the plurality of thermal bumps is coupled to the ground plane.

14. The device of claim 13, further comprising a thermal enhancement ring formed on the thermally conductive insulating layer.

15. The device of claim 14, wherein at least one of the plurality of thermal bumps is coupled to the thermal enhancement ring.

16. The device of claim 13, wherein the RF filter is used for a 5G signal.

17. A method of making a thermally enhanced passive on glass device, comprising:

forming a thermally conductive insulating layer on a surface of a glass substrate;

forming a plurally of metal layers above the thermally conductive insulating layer;

forming interlayer dielectric layers between the plurality of metal layers;

forming a plurality of vias between the plurality of metal layers and extending through the interlayer dielectric layers; and

forming thermal bumps on a surface of the device, the thermal bumps coupled to vias extending through the interlayer dielectric layers and coupled to the thermally conductive insulating layer.

18. The method of claim 17, wherein the thermally conductive insulating layer is diamond.

19. The method of claim 17, wherein the thermally conductive insulating layer comprises diamond.

20. The method of claim 17, wherein the thermally conductive insulating layer comprises aluminum nitride.

21. The method of claim 17, wherein the thermally conductive insulating layer comprises boron nitride.

22. The method of claim 17, further comprising forming a thermal enhancement ring on the thermally conductive insulating layer.