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Fine-scale interconnect with micro-air bridge

  • US 10,453,778 B1
  • Filed: 08/09/2017
  • Issued: 10/22/2019
  • Est. Priority Date: 08/09/2017
  • Status: Active Grant
First Claim
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1. An interconnect on a substrate comprising:

  • a first section comprising a first stalk segment on the substrate and a first cap segment coupled to a distal end of the first stalk segment, away from the substrate, the first stalk segment having a first width and the first cap segment having a second width, the first width narrower than the second width along a lateral direction parallel to a surface of the substrate;

    a second section comprising a second cap segment laterally displaced from the first cap segment along the lateral direction and connected to the first cap segment at a first end of the second cap segment; and

    a third section comprising a second stalk segment on the substrate and a third cap segment coupled to a distal end of the second stalk segment, away from the substrate, one end of the third cap segment laterally displaced from the second cap segment along the lateral direction and connected to a second end of the second cap segment, the second stalk segment having the first width and the third cap segment having the second width;

    wherein the second cap segment is suspended between the first cap segment and the third cap segment with a layer of air separating the second cap segment from the substrate.

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