Electrodeposited contact terminal for use as an electrical connector or semiconductor packaging substrate

• US 10,453,789 B2
• Filed: 09/07/2017
• Issued: 10/22/2019
• Est. Priority Date: 07/10/2012
• Status: Active Grant

• Current Assignee: HSIO Technologies LLC
• Original Assignee: HSIO Technologies LLC
• Inventors: Rathburn, James J.
• Primary Examiner(s): Ng, Sherman
• Application Number:
  US15/698,271
• Publication Number:
  US 20180012832A1
• Time in Patent Office: 775 Days
• Field of Search: 174260
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01R 12/52 connecting to other rigid printed circuits or like structures
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/10962 Component not directly connected to the PCB
• CPC Class Codes: H05K 3/32 electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence

Abstract

An electrical connectors with electrodeposited terminals that are grown in place by electroplating cavities formed in a series of resist layers. The resist layers are subsequently stripped away. The resulting terminal shape is defined by the shape of the cavity created in the resist layers. Complex terminal shapes are possible. The present conductive terminals are particularly useful for electrical interconnects and semiconductor packaging substrates.

Claims

1. An electrical assembly comprising:

an electrical connector comprising;

a substrate with a plurality of openings corresponding to a desired arrangement of electrodeposited terminals;

electrodeposited terminals located in the openings in the substrate, the electrodeposited terminals comprising neck portions with a first cross-sectional shape and distal portions having a second cross-sectional shape larger than the first cross sectional shape, wherein the distal portions and at least a portion of the neck portions are attached to, and extend above, a first surface of the substrate to create free standing electrodeposited terminals, the distal portions include cantilevered portions that extend beyond the neck portions that create undercuts located between the distal portions and the first surface of the substrate;

a dielectric material located on a second surface of the substrate with terminal openings aligned with proximal portions of the electrodeposited terminals;

a first circuit member with electrical terminals positioned in the terminal openings and electrically coupled to the proximal portions of the electrodeposited terminals; and

a second circuit member electrically coupled to the distal ends of the electrodeposited terminals, wherein the second circuit member comprises an interconnect having spring contact members located in openings, wherein protrusions on the spring contact members form a compressive engagement with the neck portions of the electrodeposited terminals.

2. The assembly of claim 1 wherein inside surfaces of the terminal openings are plated.

3. The assembly of claim 2 wherein the first circuit member comprises a BGA device with solder terminals electrically coupled with the plating in the terminal openings.

4. The assembly of claim 3 wherein at least one of the solder terminals on the BGA device and the plating in the terminal openings are plastically deformed in order to electrically couple the solder terminals to the electrodeposited terminals.

5. The assembly of claim 1 wherein the first circuit member is a BGA device with solder terminals reflowed to electrically couple to the electrodeposited terminals.

6. The assembly of claim 1 wherein one or more of the substrate retaining the electroplated terminals or the dielectric material on the second surface of the substrate comprises a liquid crystal polymer.

7. The assembly of claim 1 wherein one or more of the substrate retaining the electroplated terminals or the dielectric material on the second surface of the substrate comprises a flexible circuit member.

8. The assembly of claim 1 wherein one or more of the substrate retaining the electroplated terminals or the dielectric material on the second surface of the substrate comprises at least one circuit traces electrically coupling at least two of the electrodeposited terminals.

9. The assembly of claim 1 wherein the dielectric material on the second surface of the substrate comprises a flexible circuit member with a plurality of recesses that receive proximal portions of the electrodeposited terminals.

10. The assembly of claim 1 wherein the distal portions of the electrodeposited terminals comprise two cantilevered portions that extend beyond the neck portions in different directions relative to the neck portion.

11. The assembly of claim 1 comprising at least one extension electrodeposited on a proximal end of an electrodeposited terminal configured to engage with the electrical terminals on the first circuit member.

12. The assembly of claim 1 wherein compressive engagement of the spring contact members with the neck portion of the electrodeposited terminals forms a snap-fit coupling that retains the second circuit member in engagement with the electrical connector.

13. The assembly of claim 1 wherein the second circuit member comprises contact members with openings having shapes complementary to neck portions of the electroplated terminals.

14. The assembly of claim 1 wherein the second circuit member comprises contact members that slide into engagement with the neck portions of the electroplated terminals.

15. The assembly of claim 1 wherein the second circuit member comprises contact members that provide a zero insertion force or low insertion force engagement with the neck portions of the electroplated terminals.

16. The assembly of claim 15 comprising a lateral load generally parallel to the first surface of the substrate retaining the electrodeposited terminals maintains engagement with the contact members on the second circuit member.

17. An electrical assembly comprising:

an electrical connector comprising;

a substrate with a plurality of openings corresponding to a desired arrangement of electrodeposited terminals;

electrodeposited terminals located in the openings in the substrate, the electrodeposited terminals comprising neck portions with a first cross-sectional shape and distal portions having a second cross-sectional shape larger than the first cross sectional shape, wherein the distal portions and at least a portion of the neck portions are attached to, and extend above, a first surface of the substrate to create free standing electrodeposited terminals, the distal portions include cantilevered portions that extend beyond the neck portions that create undercuts located between the distal portions and the first surface of the substrate;

a first circuit member comprising a flexible circuit member located on a second surface of the substrate with a plurality of terminal openings aligned to receive proximal portions of the electrodeposited terminals, the flexible circuit member including a plurality of circuit traces electrically coupled to the electrodeposited terminals; and

a second circuit member electrically coupled to the distal ends of the electrodeposited terminals, wherein the second circuit member comprises contact members that provide a zero insertion force or low insertion force engagement with the neck portions of the electroplated terminals.

18. The assembly of claim 17 wherein the substrate retaining the electroplated terminals comprises at least one circuit traces electrically coupling at least two of the electrodeposited terminals.

19. The assembly of claim 17 wherein one or more of the substrate retaining the electroplated terminals or the flexible circuit member comprises a liquid crystal polymer.

20. An electrical assembly comprising:

an electrical connector comprising;

a substrate with a plurality of openings corresponding to a desired arrangement of electrodeposited terminals;

electrodeposited terminals located in the openings in the substrate, the electrodeposited terminals comprising neck portions with a first cross-sectional shape and distal portions having a second cross-sectional shape larger than the first cross sectional shape, wherein the distal portions and at least a portion of the neck portions are attached to, and extend above, a first surface of the substrate to create free standing electrodeposited terminals, the distal portions include cantilevered portions that extend beyond the neck portions that create undercuts located between the distal portions and the first surface of the substrate;

a dielectric material located on a second surface of the substrate with terminal openings aligned with proximal portions of the electrodeposited terminals;

a first circuit member with electrical terminals positioned in the terminal openings and electrically coupled to the proximal portions of the electrodeposited terminals; and

a second circuit member electrically coupled to the distal ends of the electrodeposited terminals, wherein the second circuit member comprises contact members that provide a zero-insertion force or low insertion force engagement with the neck portions of the electroplated terminals.