Display apparatus and method of manufacturing the same

• US 10,453,875 B2
• Filed: 03/05/2018
• Issued: 10/22/2019
• Est. Priority Date: 08/31/2015
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Group)
• Original Assignee: Samsung Display Company Limited (Samsung Group)
• Inventors: Bae, Jongsung, Kim, Mugyeom
• Primary Examiner(s): Page, Dale E
• Assistant Examiner(s): Jefferson, Quovaunda
• Application Number:
  US15/911,243
• Publication Number:
  US 20180197899A1
• Time in Patent Office: 596 Days
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/1259 Multistep manufacturing methods
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of manufacturing a display apparatus includes separating a light-emitting diode (“LED”) chip from a base substrate; disposing the separated light-emitting diode chip in a solution; disposing a substrate including a first electrode thereon, in the solution; with the separated light-emitting diode chip and the substrate including the first electrode thereon in the solution, applying a negative voltage to the substrate to attract the separated light-emitting diode chip to the first electrode on the substrate; mounting the light-emitting diode chip attracted to the first electrode, on the first electrode; and removing the substrate with the light-emitting diode chip mounted on the first electrode from the solution and drying the removed substrate, to form the display apparatus.

Claims

1. A display apparatus comprising:

a substrate comprising a first recess and a second recess; and

a first light-emitting diode chip which emits a first color and is mounted on the first recess; and

a second light-emitting diode chip which emits a second color and is mounted on the second recess, the second color being different from the first color,

wherein

each of the first and second recesses includes a first electrode and a second electrode spaced apart from each other along a thickness direction of the substrate,

a shape of each of the first and second light-emitting diode chips corresponds to the arrangement of the first and second electrodes spaced apart from each other of the first and second recesses on which the first and second light-emitting diode chips are mounted, respectively,

each of the first and second light-emitting diode chips includes a first electrode pad and a second electrode pad, the first electrode pad and the second electrode pad being arranged along the thickness direction of the substrate, and

the first electrode pad is disposed closer to a bottom surface of the substrate than the second electrode pad.

2. The apparatus of claim 1, wherein the first recess and the second recess have a same shape.

3. The apparatus of claim 1, wherein the first recess and the second recess have different shapes from each other.

4. The apparatus of claim 1, wherein

the first electrode contacts the first electrode pad, and

the second electrode contacts the second electrode pad.

5. The apparatus of claim 4, further comprising a thin film transistor between the substrate, and each of the first and second recesses, respectively,

wherein one of the first electrode and the second electrode is electrically connected to the thin film transistor.

6. The apparatus of claim 5, further comprising a bank between the second electrode and the thin film transistor in the direction toward the substrate, the bank covering an edge of the first electrode.

7. The apparatus of claim 1, further comprising an encapsulation member which encapsulates the first light-emitting diode chip and the second light-emitting diode chip,

wherein the encapsulation member individually encapsulates each of the first light-emitting diode chip and the second light-emitting diode chip.

8. The apparatus of claim 1, further comprising an encapsulation member which encapsulates the first light-emitting diode chip and the second light-emitting diode chip,

wherein the encapsulation member commonly encapsulates both of the first light-emitting diode chip and the second light-emitting diode chip.

9. A display apparatus comprising:

a substrate comprising a first recess, a second recess and a third recess;

a first light-emitting diode chip which is mounted on the first recess and emits a first color;

a second light-emitting diode chip which is mounted on the second recess and emits a second color different from the first color; and

a third light-emitting diode chip which is mounted on the third recess and emits a third color different from the first color and the second color,

wherein

each of a light-emitting diode chip among the first, second and third light-emitting diode chips includes a first electrode pad and a second electrode pad arranged spaced apart from each other along a thickness direction of the substrate,

a shape of a respective recess among the first, second and third recesses corresponds to the arrangement of the first and second electrodes spaced apart from each other of the light-emitting diode chip mounted thereon,

the display apparatus emits a white color as a mixture of the first, second and third colors,

each of the first and second light-emitting diode chips includes a first electrode pad and a second electrode pad, the first electrode pad and the second electrode pad being arranged along the thickness direction of the substrate, and

the first electrode pad is disposed closer to a bottom surface of the substrate than the second electrode pad.

10. A display apparatus comprising:

a substrate comprising a plurality of recesses each including a first electrode and a second electrode arranged spaced apart from each other; and

a plurality of light-emitting diode chips respectively mounted in the plurality of recesses,

wherein

each one light-emitting diode chip among the plurality of light-emitting diode chips, which is mounted in a recess among the plurality of recesses, comprises a first electrode pad and a second electrode pad which is disposed closer to a bottom surface of the substrate than the first electrode pad, and

along the thickness direction of the substrate, a shape of the each one light-emitting diode chip corresponds to positions of the first electrode and the second electrode spaced apart from each other.