OLED device encapsulating method and structure, OLED device, and display screen

• US 10,454,064 B2
• Filed: 05/17/2019
• Issued: 10/22/2019
• Est. Priority Date: 06/20/2017
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Huang, Hui
• Primary Examiner(s): Maruf, Sheikh
• Application Number:
  US16/416,012
• Publication Number:
  US 20190273219A1
• Time in Patent Office: 158 Days
• Field of Search: 438 82, 438 99-100
• CPC Class Codes: H10K 50/841 Self-supporting sealing arrangements
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass
• CPC Class Codes: H10K 71/135 using ink-jet printing

Abstract

A method for encapsulating an OLED device includes providing a substrate on which a barrier layer is formed; forming a surface active layer that includes multiple strips on the barrier layer; forming buffer strips on the surface active layer to correspond, in a one-to-one manner, to the strips of the surface active layer; and allowing the buffer strips to spread over the substrate and cover the barrier layer to form a buffer layer. The surface active layer that is sandwiched between and in direct contact with the barrier layer and the buffer layer includes a material that creates a hydrogen bond with a material of the buffer layer to enhance bonding therebetween.

Claims

1. An organic light-emitting diode (OLED) device encapsulating method configured to encapsulate an OLED, comprising:

providing a substrate that is adapted to cover an OLED and forming a barrier layer on the substrate;

forming a surface active layer on the barrier layer by inkjet printing, wherein the surface active layer comprises a plurality of strips arranged in the form of a matrix;

forming buffer strips on the surface active layer, wherein the buffer stripes are in one-to-one correspondence with the plurality of strips of the surface active layer; and

allowing the buffer strips to diffuse and overspread the substrate and cover the barrier layer to form a buffer layer;

wherein the surface active layer is sandwiched between and in direct contact with the barrier layer and the buffer layer and the surface active layer comprises a material that creates a hydrogen bond with a material of the buffer layer to enhance bonding therebetween.

2. The OLED device encapsulating method of claim 1, wherein the surface active layer has a thickness that is less than 100 microns.

3. The OLED device encapsulating method of claim 1, wherein the surface active layer comprises one of a hydrophilic polymer active material, a polyol based salt, and polyol based ethers.

4. The OLED device encapsulating method of claim 1, further comprising heating the substrate to remove the surface active layer.