Connection pad for embedded components in PCB packaging

• US 10,455,707 B1
• Filed: 08/10/2018
• Issued: 10/22/2019
• Est. Priority Date: 08/10/2018
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Kiplinger, Kenneth Leland, Beesley, Mark J., Arnold, Shawn Xavier, Ratnayake, Shyam Harindralal, Lee, Meng Chi
• Primary Examiner(s): Aychillhum, Andargie M
• Application Number:
  US16/100,456
• Time in Patent Office: 438 Days
• Field of Search: 361767
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24195 the item being a discrete passive component
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/92 Specific sequence of method steps
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/18162 : of a chip with build-up interconnect
• CPC Class Codes: H01L 2924/19011 : including integrated passive components
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/112 : directly combined with via connections
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09481 : Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 2201/10227 : Other objects, e.g. metallic pieces
• CPC Class Codes: H05K 2201/10431 : Details of mounted components printed components H05K1/16
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: H05K 3/3463 : Solder compositions in relation to features of the printed circuit board or the mounting process
• CPC Class Codes: H05K 3/4623 : the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: H05K 3/4691 : Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Abstract

Described herein are printed circuit boards (PCBs), PCB assemblies, and methods of manufacture thereof, which allow free placement of electrical components. The PCBs may have electrical pads that may couple to components through via-based connections and without the use of solder. The electrical components may be physically attached to the PCBs through tight fitting, lamination, and/or the use of adhesives. The distance between adjacent vias may be reduced, as accidental short-circuit risks due to solder bridging and similar effects are mitigated when the soldering process is bypassed. The PCB design and component placement may be flexible as to allow the use of electrical components with custom shape and/or customized terminal placement.

Claims

1. A printed circuit board (PCB) assembly, comprising:

a first plurality of metallic routes that form an electrical circuit of the PCB assembly and comprises a first metallic trace disposed in a core of the PCB assembly;

a plurality of electrical pads, wherein a first electrical pad of the plurality of electrical pads comprises a first via termination of a first via and the first via is electrically coupled to the first metallic trace; and

an electrical component electrically disposed in the first electrical pad, wherein a first component termination of the electrical component is directly contacting the first via termination.

2. The PCB assembly of claim 1, wherein the plurality of electrical pads is arranged in a grid array that comprises a plurality of rows and a plurality of columns, and wherein each electrical pad comprises a width and a length.

3. The PCB assembly of claim 2, wherein the width is 200 μ

m or the length is 200 μ

m.

4. The PCB assembly of claim 1, wherein the first electrical pad comprises a second via termination of a second via.

5. The PCB assembly of claim 4, wherein the electrical component comprises a second component termination directly in contact with the second via termination of the second via.

6. The PCB assembly of claim 4, comprising a second electrical component disposed in the first electrical pad, wherein a second component termination of the second electrical component is directly contacting the second via termination of the second via.

7. The PCB assembly of claim 1, wherein the first electrical pad comprises a plurality of vias electrically coupled to each other and configured to form a single connection to the first component termination of the electrical component, wherein a number of vias in the plurality of vias is based on a resistance specification or an inductance specification, and wherein the resistance specification or the inductance specification is based on the electrical component.

8. The PCB assembly of claim 1, comprising a first cavity that comprises the first electrical pad, and wherein the electrical component is disposed in the first cavity.

9. The PCB assembly of claim 8, comprising a resin configured to hold the electrical component in the first cavity.

10. An electronic device, comprising:

a printed circuit board (PCB), comprising;

a first electrical circuit that comprises a plurality of metallic traces disposed in a core of the PCB and a plurality of metallic vias, wherein each via of the plurality of metallic vias is coupled to a first metallic trace of the plurality of metallic traces;

a plurality of electrical pads, wherein each electrical pad of the plurality of electrical pads comprise a plurality of via terminations, and each respective via termination of the plurality of via terminations is associated to a respective via of the plurality of metallic vias; and

an electrical component electrically coupled to the first electrical circuit and disposed in a first electrical pad of the plurality of electrical pads, wherein each respective component termination of the electrical component is in direct contact with a corresponding via termination of the plurality of via terminations.

11. The electronic device of claim 10, wherein the first electrical pad is a non-uniform electrical pad.

12. The electronic device of claim 10, comprising a second electrical pad of the plurality of electrical pads, wherein the second electrical pad comprises a shielding pad electrically coupled to a ground of the PCB.

13. The electronic device of claim 12, wherein the first electrical pad and the second electrical pad are nested, and wherein the shielding pad is configured to provide electrical shielding to at least one via termination of the plurality of via terminations.

14. The electronic device of claim 10, comprising a second electrical component, wherein the second electrical component is soldered to the PCB.

15. The electronic device of claim 10, wherein the first electrical pad comprises a cavity and the electrical component is disposed in the cavity.

16. The electronic device of claim 15, comprising a resin that covers the electrical component.

17. The electronic device of claim 10, wherein the PCB comprises a multilayer PCB.

18. A method comprising:

forming a first metallic trace in a core of a printed circuit board (PCB);

forming a first via in the PCB, wherein the first via is electrically coupled to the first metallic trace, and wherein a via termination of the first via is exposed in an electrical pad of the PCB; and

disposing a first electrical component in the electrical pad of the PCB by forming a direct contact between a component termination of the first electrical component and the via termination of the first via.

19. The method of claim 18, comprising forming a cavity in the core of the PCB, wherein the cavity is configured to receive the first electrical component.

20. The method of claim 19, comprising encapsulating the first electrical component using a resin.

21. A printed circuit board (PCB) assembly, comprising:

a first plurality of metallic routes that form an electrical circuit of the PCB assembly;

a plurality of electrical pads, wherein a first electrical pad of the plurality of electrical pads comprises;

a first via termination of a first via, wherein the first via is electrically coupled to the first plurality of metallic routes plurality of vias electrically coupled to each other and to the first plurality of metallic routes and wherein the plurality of vias form a single connection;

a plurality of vias electrically coupled to each other and configured to form a single connection to the first component termination of the electrical component, wherein a number of vias in the plurality of vias is based on a resistance specification or an inductance specification, and wherein the resistance specification or the inductance specification is based on the electrical component; and

an electrical component electrically disposed in the first electrical pad, wherein a first component termination of the electrical component is directly contacting the first via termination and comprising a first component termination in direct contact with the single connection.

22. The PCB assembly of claim 21, wherein the electrical component comprises a second component termination in direct contact with a second connection disposed in the first electrical pad.

23. The PCB assembly of claim 21, comprising a first cavity that comprises the first electrical pad, and wherein the electrical component is disposed in the first cavity.