Enclosure cooling system

• US 10,455,729 B2
• Filed: 03/23/2017
• Issued: 10/22/2019
• Est. Priority Date: 01/10/2014
• Status: Active Grant

• Current Assignee: ASM America Incorporated (ASM International NV)
• Original Assignee: Reno Technologies Inc.
• Inventors: Bhutta, Imran Ahmed
• Primary Examiner(s): Patel, Mukundbhai G
• Application Number:
  US15/467,667
• Publication Number:
  US 20170202106A1
• Time in Patent Office: 943 Days
• Field of Search: 26167947, 261698, 261702
• CPC Class Codes: H01J 37/32183 Matching circuits
• CPC Class Codes: H01J 37/32522 Temperature
• CPC Class Codes: H01J 37/32577 Electrical connecting means
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge
• CPC Class Codes: H01J 37/3299 Feedback systems
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H03H 11/30 Automatic matching of source impedance to load impedance
• CPC Class Codes: H03H 7/38 Impedance-matching networks
• CPC Class Codes: H05K 7/20154 Heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20218 using a liquid coolant without phase change in electronic enclosures in cabinets of standardized dimensions H05K7/20536; in server cabinets H05K7/20709; in vehicle electronic casings H05K7/20845; in power control electronics H05K7/2089; in displays H05K7/20954

Abstract

In one embodiment, the invention can be a system for cooling an enclosure enclosing electrical components and configured to prevent air and exhaust from escaping the enclosure. The system can include a heat sink comprising a heat exchanger, and a tube extending into and out of the heat exchanger, the tube configured to transport liquid through the heat exchanger. The system can further include a fan configured to push air heated by electrical components onto the heat exchanger. The heat exchanger can be configured to receive heat from air pushed by the fan, and transfer the received heat to the liquid being transported by the tube through the heat exchanger.

Claims

1. A system comprising:

an enclosure enclosing electrical components and configured to prevent air within the enclosure and exhaust from the electrical components from escaping the enclosure;

a heat sink at least partially within the enclosure, the heat sink comprising;

a main housing within the enclosure, the main housing having a flat and thermally conductive main housing surface for laying against an electrical component shelf surface or for receiving electrical components directly thereon;

thermally conductive fins positioned alongside each other, adjacent to the main housing, and within the enclosure; and

a tube extending into and out of each of the main housing and the fins to transport liquid through both the main housing and the fins; and

a fan enclosed by the enclosure, the fan configured to push air heated by electrical components onto the fins;

wherein the fins are configured to receive a first heat from air pushed by the fan, and transfer the received first heat to the liquid being transported by the tube through the fins;

wherein the main housing is configured to receive a second heat from the electrical components on the thermally conductive main housing surface and transfer the received second heat to the liquid being transported by the tube;

wherein the main housing further comprises a first edge and a second edge opposite the first edge;

wherein the fins further comprise a first edge and a second edge opposite the first edge, the main housing second edge being adjacent the fins first edge;

wherein the tube enters the main housing at the main housing first edge;

wherein the tube enters the fins at the fins first edge;

wherein the tube exits the fins at the fins first edge; and

wherein the tube exits the main housing at the main housing first edge.

2. The system of claim 1 wherein the electrical components form part of a system for manufacturing semiconductors.

3. The system of claim 1 wherein the fan is mounted on the heat sink.

4. The system of claim 1 wherein the main housing second edge is in contact with the fins first edge.

5. A method of cooling an enclosure enclosing electrical components and configured to prevent air within the enclosure and exhaust from the electrical components from escaping the enclosure, the method comprising:

positioning a heat sink at least partially within the enclosure, the heat sink comprising;

a main housing within the enclosure, the main housing having a flat and thermally conductive main housing surface for laying against an electrical component shelf surface or for receiving electrical components directly thereon;

thermally conductive fins positioned alongside each other, adjacent to the main housing, and within the enclosure; and

a tube extending into and out of each of the main housing and the fins to transport liquid through both the main housing and the fins;

a fan enclosed by the enclosure configured to push air heated by electrical components onto the fins;

receiving, at the fins, a first heat from the pushed air;

transferring, by the fins, the received first heat to liquid being transported by the tube through the fins; and

receiving, by the main housing, a second heat from the electrical components on the thermally conductive main housing surface, and transferring the received second heat to the liquid being transported by the tube;

wherein the main housing further comprises a first edge and a second edge opposite the first edge;

wherein the fins further comprise a first edge and a second edge opposite the first edge, the main housing second edge being adjacent the fins first edge;

wherein the tube enters the main housing at the main housing first edge;

wherein the tube enters the fins at the fins first edge;

wherein the tube exits the fins at the fins first edge; and

wherein the tube exits the main housing at the main housing first edge.

6. The method of claim 5 wherein the electrical components form part of a system for manufacturing semiconductors.

7. The method of claim 5 wherein the electrical components form part of an RF generator or an RF matching network.

8. The method of claim 7 further comprising, upon receipt of a fault signal, removing power from inputs of the RF generator or the RF matching network.

9. The method of claim 7 further comprising, upon receipt of a fault signal, opening a system interlock.

10. The method of claim 5 wherein the fan is mounted on the heat sink.

11. The method of claim 5 wherein the main housing and fins are located side-by-side and contact each other along at least one edge.

12. The method of claim 5 wherein the tube extends along a first side of the main housing and a second side of the main housing opposite the first side.

13. A method of manufacturing a semiconductor, the method comprising:

operably coupling a matching network between an RF source and a plasma chamber, wherein the plasma chamber is configured to deposit a material layer onto the substrate or etch a material layer from the substrate, and electrical components of the RF source or the matching network are enclosed by an enclosure that is configured to prevent air within the enclosure and exhaust from the electrical components from escaping the enclosure;

positioning a heat sink at least partially within the enclosure, the heat sink comprising;

a main housing within the enclosure, the main housing having a flat and thermally conductive main housing surface for laying against an electrical component shelf surface or for receiving electrical components directly thereon;

thermally conductive fins positioned alongside each other, adjacent to the main housing, and within the enclosure; and

a tube extending into and out of each of the main housing and the fins to transport liquid through both the main housing and the fins;

placing a substrate in the plasma chamber;

energizing plasma within the plasma chamber by coupling RF power from the RF source into the plasma chamber to perform a deposition or etching;

a fan enclosed by the enclosure, pushing air heated by electrical components onto the fins;

receiving, at the fins, a first heat from the pushed air; and

transferring, by the fins, the received first heat to liquid being transported by the tube through the fins; and

receiving, by the main housing, a second heat from the electrical components on the thermally conductive main housing surface, and transferring the received second heat to the liquid being transported by the tube;

wherein the main housing further comprises a first edge and a second edge opposite the first edge;

wherein the fins further comprise a first edge and a second edge opposite the first edge, the main housing second edge being adjacent the fins first edge;

wherein the tube enters the main housing at the main housing first edge;

wherein the tube enters the fins at the fins first edge;

wherein the tube exits the fins at the fins first edge; and

wherein the tube exits the main housing at the main housing first edge.

14. A heat sink comprising:

a main housing within an enclosure, the main housing having a flat and thermally conductive main housing surface for laying against an electrical component shelf surface or for receiving electrical components directly thereon;

thermally conductive fins positioned alongside each other, adjacent to the main housing, and within an enclosure; and

a tube extending into and out of each of the main housing and the fins to transport liquid through both the main housing and the fins;

wherein the fins are configured to receive a first heat from air heated by electrical components, and transfer the received heat to the liquid being transported by the tube through the fins; and

wherein the main housing is configured to receive a second heat from the electrical components on the thermally conductive main housing surface and transfer the received second heat to the liquid being transported by the tube;

wherein the main housing further comprises a first edge and a second edge opposite the first edge;

wherein the fins further comprise a first edge and a second edge opposite the first edge, the main housing second edge being adjacent the fins first edge;

wherein the tube enters the main housing at the main housing first edge;

wherein the tube enters the fins at the fins first edge;

wherein the tube exits the fins at the fins first edge; and

wherein the tube exits the main housing at the main housing first edge.

15. A semiconductor processing tool comprising:

a plasma chamber configured to deposit a material onto a substrate or etch a material from the substrate;

an impedance matching circuit operably coupled to the plasma chamber; and

an enclosure enclosing electrical components of the matching circuit, the enclosure configured to prevent air within the enclosure and exhaust from the electrical components from escaping the enclosure;

a heat sink at least partially within the enclosure, the heat sink comprising;

a main housing within the enclosure;

thermally conductive fins positioned alongside each other, adjacent to the main housing, and within the enclosure; and

a tube extending into and out of each of the fins to transport liquid through both the main housing and the fins; and

a fan enclosed by the enclosure, the fan configured to push air heated by electrical components onto the fins;

wherein the fins are configured to receive heat from air pushed by the fan, and transfer the received heat to the liquid being transported by the tube through the fins;

wherein the main housing further comprises a first edge and a second edge opposite the first edge;

wherein the fins further comprise a first edge and a second edge opposite the first edge, the main housing second edge being adjacent the fins first edge;

wherein the tube enters the main housing at the main housing first edge;

wherein the tube enters the fins at the fins first edge;

wherein the tube exits the fins at the fins first edge; and

wherein the tube exits the main housing at the main housing first edge.