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Wipe for killing spores

  • US 10,455,838 B2
  • Filed: 09/16/2016
  • Issued: 10/29/2019
  • Est. Priority Date: 04/28/2014
  • Status: Active Grant
First Claim
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1. A process for killing bacterial spores positioned on a substrate, comprising:

  • contacting the bacterial spores with an aqueous composition using an absorbent sheet, the aqueous composition consisting essentially of water, peracetic acid, acetic acid, sulfuric acid, and hydrogen peroxide, the concentration of the hydrogen peroxide in the water being in the range from 0.1 to 0.8% by weight, the concentration of the peracetic acid being in the range from 0.005 to 0.08% by weight, the weight ratio of the peracetic acid to the hydrogen peroxide being in the range from 0.001 to 0.1, the concentration of acetic acid being in the range from 0.001 to 0.3% by weight, and the concentration of sulfuric acid being in the range from 0.001 to 0.3% by weight; and

    maintaining the aqueous composition in contact with the bacterial spores at a temperature in the range from about 1°

    C. to about 40°

    C. for an effective period of time to effect at least a 4 log reduction in the number of bacterial spores capable of returning to vegetative growth.

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