Wipe for killing spores
First Claim
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1. A process for killing bacterial spores positioned on a substrate, comprising:
- contacting the bacterial spores with an aqueous composition using an absorbent sheet, the aqueous composition consisting essentially of water, peracetic acid, acetic acid, sulfuric acid, and hydrogen peroxide, the concentration of the hydrogen peroxide in the water being in the range from 0.1 to 0.8% by weight, the concentration of the peracetic acid being in the range from 0.005 to 0.08% by weight, the weight ratio of the peracetic acid to the hydrogen peroxide being in the range from 0.001 to 0.1, the concentration of acetic acid being in the range from 0.001 to 0.3% by weight, and the concentration of sulfuric acid being in the range from 0.001 to 0.3% by weight; and
maintaining the aqueous composition in contact with the bacterial spores at a temperature in the range from about 1°
C. to about 40°
C. for an effective period of time to effect at least a 4 log reduction in the number of bacterial spores capable of returning to vegetative growth.
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Abstract
This invention relates to a wipe for killing spores comprising an absorbent sheet holding an aqueous composition and a sealed package containing the absorbent sheet, wherein the aqueous composition comprises water, an antimicrobial agent and a peroxide. The invention also relates to a process for killing spores using the above-indicated wipe.
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Citations
10 Claims
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1. A process for killing bacterial spores positioned on a substrate, comprising:
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contacting the bacterial spores with an aqueous composition using an absorbent sheet, the aqueous composition consisting essentially of water, peracetic acid, acetic acid, sulfuric acid, and hydrogen peroxide, the concentration of the hydrogen peroxide in the water being in the range from 0.1 to 0.8% by weight, the concentration of the peracetic acid being in the range from 0.005 to 0.08% by weight, the weight ratio of the peracetic acid to the hydrogen peroxide being in the range from 0.001 to 0.1, the concentration of acetic acid being in the range from 0.001 to 0.3% by weight, and the concentration of sulfuric acid being in the range from 0.001 to 0.3% by weight; and maintaining the aqueous composition in contact with the bacterial spores at a temperature in the range from about 1°
C. to about 40°
C. for an effective period of time to effect at least a 4 log reduction in the number of bacterial spores capable of returning to vegetative growth. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification