Method for treating a semiconductor device
First Claim
1. A method of treating a sensor array, the sensor array including a plurality of sensors, a sensor of the plurality of the sensors including a sensor pad, a well structure defining a well array having a plurality of wells, a well of the plurality of wells disposed over each sensor of the sensor array and providing an opening to the sensor pad, a lid attached over the sensor array and the well structure and including a fluid port, a space defined between the lid and the well structure, the method comprising:
- applying a treatment solution through the fluid port into the space and waiting for a first period between 30 seconds and 30 minutes, the treatment solution entering the well and contacting the sensor pad, the treatment solution including an organo-silicon compound, an organic acid and an organic solvent, the organic solvent has a normal boiling point in a range of 36°
C. to 345°
C.;
applying a basic solution through the fluid port into the space and waiting for a second period between 20 seconds and 15 minutes, the basic solution entering the well and contacting the sensor pad; and
applying a rinse solution through the fluid port the rinse solution entering the well and contacting the sensor pad.
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Accused Products
Abstract
A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.
43 Citations
19 Claims
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1. A method of treating a sensor array, the sensor array including a plurality of sensors, a sensor of the plurality of the sensors including a sensor pad, a well structure defining a well array having a plurality of wells, a well of the plurality of wells disposed over each sensor of the sensor array and providing an opening to the sensor pad, a lid attached over the sensor array and the well structure and including a fluid port, a space defined between the lid and the well structure, the method comprising:
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applying a treatment solution through the fluid port into the space and waiting for a first period between 30 seconds and 30 minutes, the treatment solution entering the well and contacting the sensor pad, the treatment solution including an organo-silicon compound, an organic acid and an organic solvent, the organic solvent has a normal boiling point in a range of 36°
C. to 345°
C.;applying a basic solution through the fluid port into the space and waiting for a second period between 20 seconds and 15 minutes, the basic solution entering the well and contacting the sensor pad; and applying a rinse solution through the fluid port the rinse solution entering the well and contacting the sensor pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification