Welding system with potted circuit board and method of making thereof

• US 10,456,851 B2
• Filed: 07/17/2015
• Issued: 10/29/2019
• Est. Priority Date: 07/17/2015
• Status: Active Grant

• Current Assignee: Illinois Tool Works Inc.
• Original Assignee: Illinois Tool Works Inc.
• Inventors: Borneman, Brian J., Henry, Andrew J
• Primary Examiner(s): Hoang, Tu B
• Assistant Examiner(s): Rosario-Aponte, Alba T
• Application Number:
  US14/802,351
• Publication Number:
  US 20170014934A1
• Time in Patent Office: 1,565 Days
• Field of Search: 2191301, 219136, 21913021, 21913033, 2191305
• CPC Class Codes: B23K 9/1043 characterised by the electric circuit B23K9/1012 takes precedence
• CPC Class Codes: B23K 9/16 making use of shielding gas selection of media B23K35/38
• CPC Class Codes: B23K 9/32 Accessories earthing connections H01R
• CPC Class Codes: H05K 2201/09972 Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 5/064 sealed by potting, e.g. waterproof resin poured in a rigid casing
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20918 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Abstract

A method and apparatus for providing welding type power is disclosed. At least one circuit board is used that is partially potted using a potting barrier affixed to the circuit board. The partially potted portion can be inside an enclosed air flow space.

Claims

1. A welding-type system comprising:

an input circuit disposed to receive input power and to provide intermediate power;

a power circuit, having a power control input and at least one switch responsive to the control input, and wherein the power circuit is disposed to receive intermediate power and provide welding type output power;

a controller, having a set point input and a control output, wherein the control output is connected to the power control input;

wherein a first subset of components from at least one of the power circuit, input circuit and controller are disposed on a first circuit board;

wherein the adhesive is a different material from the potting compound, and wherein the power circuit further includes a second subset of components; and

a potting barrier affixed to the first circuit board using at least an adhesive, and wherein the first subset of components are mounted on the circuit board within the potting barrier; and

potting compound in the entire area within the potting barrier and on the circuit board.

2. The welding-type system of claim 1, wherein the potting barrier is further affixed to the circuit board using at least one mechanical fastener.

3. The welding-type system of claim 1, wherein the potting barrier is a rigid structure when affixed to the circuit board.

4. The welding-type system of claim 1, wherein the second subset of components are at least partially mounted on the first circuit board outside of the potting barrier.

5. The welding-type system of claim 4, wherein the input circuit and the power circuit are disposed inside a housing and the first circuit board is at least partially mounted inside an enclosed air flow space within the housing.

6. The welding-type system of claim 5, wherein the controller includes a third subset of components that are at least partially mounted outside of the enclosed airflow space.

7. The welding-type system of claim 6, wherein the power circuit includes a converter with at least one converter switch and a converter switch heat sink, wherein the converter switch heat sink is in the first subset of components.

8. The welding-type system of claim 1, wherein the potting barrier defines an area that is entirely potted without voids.

9. A partially potted circuit board for use in a welding-type system comprising:

a circuit board;

a plurality of components mounted to the circuit board, wherein the plurality of components includes a first subset of components and a second subset of components;

a potting barrier affixed to the first circuit board using at least an adhesive, wherein the first subset of components are mounted on the circuit board within the potting barrier; and

potting compound within the potting barrier and on the circuit board;

wherein the adhesive is a different material from the potting compound.

10. The partially potted circuit board of claim 9, wherein the potting barrier is further affixed to the circuit board using at least one mechanical fastener.

11. The partially potted circuit board of claim 10, wherein the potting barrier is a rigid structure when affixed to the circuit board.

12. The partially potted circuit board of claim 11, wherein the second subset of components are at least partially mounted on the first circuit board outside of the potting barrier.

13. The partially potted circuit board of claim 12, wherein the welding type system includes a housing, and the partially potted circuit board is at least partially mounted inside an enclosed air flow space within the housing.

14. The partially potted circuit board of claim 9, wherein the potting barrier defines an area that is entirely potted without voids.