Manganese-containing, cobalt-based high-temperature solder alloy, powder, component and soldering method

• US 10,456,874 B2
• Filed: 12/17/2014
• Issued: 10/29/2019
• Est. Priority Date: 01/08/2014
• Status: Active Grant

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Laux, Britta
• Primary Examiner(s): Hailey, Patricia L.
• Application Number:
  US15/109,143
• Publication Number:
  US 20160325385A1
• Time in Patent Office: 1,777 Days
• Field of Search: 148528, 420434, 420435
• CPC Class Codes: B23K 1/0018 Brazing of turbine parts
• CPC Class Codes: B23K 1/19 taking account of the properties of the materials to be soldered
• CPC Class Codes: B23K 35/0244 Powders, particles or spheres; Preforms made therefrom
• CPC Class Codes: B23K 35/3046 Co as the principal constituent
• CPC Class Codes: C22C 1/0425 Copper-based alloys
• CPC Class Codes: C22C 19/007 with a light metal (alkali metal Li, Na, K, Rb, Cs; earth alkali metal Be, Mg, Ca, Sr, Ba, Al Ga, Ge, Ti) or B, Si, Zr, Hf, Sc, Y, lanthanides, actinides, as the next major constituent
• CPC Class Codes: C22C 19/07 based on cobalt
• CPC Class Codes: C22F 1/10 of nickel or cobalt or alloys based thereon

Abstract

A manganese-containing, cobalt-based alloy with zirconium, tantalum and carbon, and good cohesive joint connections, is provided.

Claims

1. A cobalt-based solder alloy comprising:

8% by weight—

16% by weight of zirconium (Zr);

6% by weight—

10% by weight of tantalum (Ta);

0.5% by weight—

1.5% by weight of carbon (C),

8% by weight—

12% by weight of manganese (Mn);

at least 0.5% by weight of titanium (Ti); and

having no boron (B), no silicon (Si), no germanium (Ge) and no gallium (Ga).

2. The cobalt-based solder alloy as claimed in claim 1, including 15% by weight of zirconium (Zr).

3. The cobalt-based solder alloy as claimed in claim 1, including 8% by weight of tantalum (Ta).

4. The cobalt-based solder alloy as claimed in claim 1, including 1% by weight of carbon (C).

5. The cobalt-based solder alloy as claimed in claim 1, including 10% by weight of manganese (Mn).

6. The cobalt-based solder alloy as claimed in claim 1, including 1% by weight of titanium (Ti).

7. The cobalt-based solder alloy as claimed in claim 1, consisting of zirconium (Zr), tantalum (Ta), carbon (C), manganese (Mn), cobalt (Co) and titanium (Ti).

8. The cobalt-based solder alloy as claimed in claim 1, consisting of zirconium (Zr), tantalum (Ta), carbon (C), manganese (Mn), cobalt (Co) and titanium (Ti).

9. The cobalt-based solder alloy as claimed in claim 1, having at most 5% by weight of titanium (Ti).

10. A powder comprising the cobalt-based solder alloy as claimed in claim 1.

11. A component comprising the cobalt-based solder alloy as claimed in claim 1.

12. A method comprising:

soldering a substrate using the cobalt-based solder alloy as claimed in claim 1.

13. The method as claimed in claim 12, wherein the soldering the substrate is carried out with a heat treatment for a cobalt-based alloy that differs from a heat treatment for an alloy that has no manganese.