Method for manufacturing liquid ejection head and liquid ejection head

• US 10,457,049 B2
• Filed: 02/20/2018
• Issued: 10/29/2019
• Est. Priority Date: 02/24/2017
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Tsutsui, Satoshi
• Primary Examiner(s): Valencia, Alejandro
• Application Number:
  US15/900,503
• Publication Number:
  US 20180244043A1
• Time in Patent Office: 616 Days
• Field of Search: None
• CPC Class Codes: B41J 2/1433 Structure of nozzle plates
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/162 Manufacturing of the nozzle plates
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2202/22 Manufacturing print heads
• CPC Class Codes: G03F 7/038 Macromolecular compounds which are rendered insoluble or differentially wettable G03F7/075 takes precedence; macromolecular azides G03F7/012; macromolecular diazonium compounds G03F7/021
• CPC Class Codes: G03F 7/11 having cover layers or intermediate layers, e.g. subbing layers G03F7/091 - G03F7/093, B41N3/03 take precedence
• CPC Class Codes: G03F 7/167 from the gas phase, by plasma deposition G03F7/2035 takes precedence
• CPC Class Codes: G03F 7/32 Liquid compositions therefor, e.g. developers
• CPC Class Codes: G03F 7/325 Non-aqueous compositions
• CPC Class Codes: G03F 7/36 Imagewise removal not covered by groups G03F7/30 - G03F7/34, e.g. using gas streams, using plasma
• CPC Class Codes: G03F 7/38 Treatment before imagewise removal, e.g. prebaking G03F7/265 takes precedence

Abstract

A method for manufacturing a liquid ejection head includes selectively exposing a first photosensitive resin layer to light, thereby curing the portion of the first photosensitive resin layer defining a flow channel member; forming a second photosensitive resin layer on the first photosensitive resin layer; selectively exposing the second photosensitive resin layer to light, thereby curing the portion of the second photosensitive resin layer defining an ejection opening member; and removing the unexposed portions of the first and the second photosensitive resin layer at one time with a developer. Before removal with the developer, the water absorption W of the intermediate layer, the water absorption W1 of the exposed portion of the first photosensitive resin layer, and the water absorption W2 of the exposed portion of the second photosensitive resin layer satisfy the relationship W≥W1>W2.

Claims

1. A method for manufacturing a liquid ejection head including a substrate, a flow channel member overlying the substrate and defining a flow channel through which a liquid flows, an ejection opening member overlying the flow channel member and defining an ejection opening through which the liquid is ejected, and an intermediate layer between the substrate and the flow channel member, the method comprising:

forming the intermediate layer over the substrate;

forming a first photosensitive resin layer over the intermediate layer;

selectively exposing the first photosensitive resin layer to light, thereby curing the portion of the first photosensitive resin layer defining the flow channel member;

forming a second photosensitive resin layer over the first photosensitive resin layer;

selectively exposing the second photosensitive resin layer to light, thereby curing the portion of the second photosensitive resin layer defining the ejection opening member; and

removing the unexposed portions of the first and the second photosensitive resin layer at one time with a developer;

wherein before the removing with the developer, water absorption W of intermediate layer, water absorption W1 of the exposed portion of the first photosensitive resin layer, and water absorption W2 of the exposed portion of the second photosensitive resin layer satisfy the relationship;

W≥

W1 >

W2,

wherein the first photosensitive resin layer and the second photosensitive resin layer are exposed to light having the same wavelength, and

wherein the second photosensitive resin layer is more sensitive to the same wavelength than the first photosensitive resin layer.

2. The method according to claim 1, wherein the forming of the intermediate layer includes exposing a resin layer to light, thereby curing the portion of the resin layer defining the intermediate layer.

3. The method according to claim 2, wherein the resin layer contains an epoxy resin and a photo-acid generator.

4. The method according to claim 2, wherein the resin layer has a thickness that is smaller than the first photosensitive resin layer and is in the range of 0.5 μ

m to 5.0 μ

m.

5. The method according to claim 1, wherein the first photosensitive resin layer and the second photosensitive resin layer each contain an epoxy resin and a photo-acid generator.