Systems and methods for producing anti-wetting structures on metallic surfaces

• US 10,458,037 B2
• Filed: 10/27/2016
• Issued: 10/29/2019
• Est. Priority Date: 10/27/2015
• Status: Active Grant

• Current Assignee: Georgia Tech Research Corporation (University System of Georgia)
• Original Assignee: Georgia Tech Research Corporation (University System of Georgia)
• Inventors: Choi, Won Tae, Breedveld, Laurens Victor, Hess, Dennis W., Oh, Kkochnim, Singh, Preet M.
• Primary Examiner(s): Smith, Nicholas A
• Application Number:
  US15/336,019
• Publication Number:
  US 20170114472A1
• Time in Patent Office: 1,097 Days
• CPC Class Codes: C25F 3/06 of iron or steel

Abstract

An exemplary embodiment of the present invention provides a method for anti-wetting metallic surfaces. A metallic object is introduced to an electrochemical solution. A cathode is introduced to the electrochemical solution, and an anode is attached to the metallic object. An electric potential between the cathode and anode is applied, such that selective electrochemical etching of the surface of the metallic object occurs. The selective etching etches grain boundaries at the surface of the metallic object, and the grain boundaries define grain faces.

Claims

1. A method comprising:

introducing a metallic object to an electrochemical solution, wherein the metallic object has a surface;

introducing a cathode to the electrochemical solution;

attaching an anode to the metallic object;

generating microscale roughness on the metallic object by applying a first electric potential between the cathode and anode, such that selective electrochemical etching of the surface of the metallic object occurs, wherein the selective etching etches grain boundaries at the surface of the metallic object, the grain boundaries defining grain faces; and

subsequent to generating the microscale roughness on the metallic object, generating nanoscale roughness on the grain faces by applying a second electrical potential between the cathode and anode, the second electrical potential being less than or equal to approximately 2.4 volts and the first electrical potential being less than the second electrical potential.

2. The method of claim 1, wherein the first electrical potential generates a first current density at the grain boundaries and a second current density at the grain faces, such that a first current density difference is defined as the first current density less the second current density.

3. The method of claim 1, wherein the first electrical potential generates a first current density at the grain boundaries and a second current density at the grain faces, such that a first current density difference is defined as the first current density less the second current density;

wherein the second electrical potential generates a third current density at the grain boundaries and a fourth current density at the grain faces, such that a second current density difference is defined as the third current density less the fourth current density; and

wherein the first current density difference is greater than the second current density difference.

4. The method of claim 1, wherein the second electrical potential is less than a threshold that leads to electrochemical polishing.

5. The method of claim 1, further comprising depositing a film onto the surface metallic object.

6. The method of claim 5, wherein the film is deposited with a thickness that maintains the nanoscale roughness on the grain faces.

7. The method of claim 6, wherein the film alters a surface chemistry of the metallic object.

8. The method of claim 6, wherein the film comprises fluorocarbon.

9. The method of claim 1, wherein the electrochemical solution comprises nitric acid.

10. The method of claim 1, wherein the metallic object comprises a metal alloy.

15. The method of claim 1, wherein the first electrical potential is greater than or equal to approximately 1.1 volts.

11. A method comprising:

providing a metallic object;

generating microscale roughness by electrochemically etching the metallic object at a first electrical potential to etch grain boundaries at a surface of the metallic object, the grain boundaries defining grain faces; and

subsequent to generating the microscale roughness, generating nanoscale roughness on the surface of the metallic object by electrochemically etching the metallic object at a second electrical potential greater than the first electrical potential, the second electrical potential being less than or equal to approximately 2.4 volts.

12. The method of claim 11, wherein, when the surface is placed into contact with water, the surface and the water have a static contact angle of at least 140 degrees.

13. The method of claim 11, wherein, when the surface is placed into contact with water, the surface and the water have a static contact angle of at least 150 degrees.

14. The method of claim 11, wherein, when the surface is placed into contact with water, the surface and the water have a static contact angle of at least 160 degrees.

16. The method of claim 11, wherein the first electrical potential is greater than or equal to approximately 1.1 volts.