Heat transfer device

• US 10,458,720 B2
• Filed: 07/22/2015
• Issued: 10/29/2019
• Est. Priority Date: 07/22/2015
• Status: Active Grant

• Current Assignee: Furukawa Electric Company Limited
• Original Assignee: Furukawa Electric Company Limited
• Inventors: Miura, Tatsuro, Inagaki, Yoshikatsu, Okada, Hiroshi
• Primary Examiner(s): Atkisson, Jianying C
• Assistant Examiner(s): Attey, Joel M
• Application Number:
  US15/579,698
• Publication Number:
  US 20180172360A1
• Time in Patent Office: 1,560 Days
• Field of Search: 16510426, 16510433
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28F 1/30 the means being attachable to the element F28F1/32 takes precedence
• CPC Class Codes: F28F 1/42 the means being both outside and inside the tubular element
• CPC Class Codes: F28F 2215/02 Arrangements of fins common to different heat exchange sections, the fins being in contact with different heat exchange media
• CPC Class Codes: F28F 2255/18 sintered
• CPC Class Codes: F28F 2275/06 by welding welding heat exchangers B23K2101/14
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H05K 7/20336 Heat pipes, e.g. wicks or capillary pumps

Abstract

A heat transfer device includes a heat pipe in which working fluid is enclosed, a heat receiving plate provided on one end side of the heat pipe and a heat radiating fin provided on the other end side of the heat pipe, a first wick and a second wick that transfer working fluid provided on an inner wall surface of the heat pipe, a bent section bent between the one end side and the other end side, and a boundary section between the first wick and the second wick disposed in a lower part in the gravity direction of the bent section of the heat pipe or the heat transfer device. The heat transfer device can improve heat transfer characteristics with a simple configuration.

Claims

1. A heat transfer device comprising:

a heat pipe in which working fluid is enclosed, a heat receiving section being provided on one end side of the heat pipe and a heat radiating section being provided on another end side of the heat pipe, wherein

on an inner wall of the heat pipe, a first wick disposed in the heat receiving section of the heat pipe and a second wick is disposed in the heat radiating section of the heat pipe, a bent section bent between the heat receiving section and the heat radiating section is provided, a boundary section between the first wick and the second wick is disposed below the bent section in a gravity direction, and the heat receiving section is disposed above the bent section in a direction of a pull of gravity,

the working fluid is stored in a liquid reservoir that includes the second wick and the boundary section between the first wick and the second wick, the liquid reservoir being formed at a lowest point of the bent section in the direction of the pull of gravity,

an end portion of the first wick is directly connected to an end portion of the second wick at the boundary section between the first wick and the second wick,

the boundary section corresponds to a lower part of the bent section in the direction of the pull of gravity, the first wick and the second wick always being soaked by the working fluid in the liquid reservoir,

capillary pressure in the first wick causes some of the working fluid to reflux to the heat receiving section, and

capillary pressure in the second wick causes some of the working fluid to be supplied to the first wick.

2. The heat transfer device according to claim 1, wherein the second wick includes a plurality of groove sections extending in a longitudinal direction on the inner wall of the heat pipe.

3. The heat transfer device according to claim 2, wherein depth of the groove sections is set to 0.10 to 0.20 mm.

4. The heat transfer device according to claim 2, wherein depth of the groove sections is a depth of 30% to 70% with respect to a wall thickness of the heat pipe.

5. The heat transfer device according to claim 1, wherein the first wick includes porous sintered metal obtained by sintering a spherical powder or deformed powder.

6. The heat transfer device according to claim 1, wherein the second wick includes a metal braded wire or a metal net.

7. The heat transfer device according to claim 1, wherein the second wick includes, in a width direction center of the heat pipe, porous sintered metal obtained by sintering a spherical powder or deformed powder, and steam channels are formed on left and right sides inside the heat pipe across the porous sintered metal.

8. The heat transfer device according to claim 1, wherein the second wick includes, in a width direction center of the heat pipe, one or more semielliptical porous sintered metals obtained by sintering a spherical powder or deformed powder, a flat section of each semielliptical porous sintered metal is disposed on the inner wall of the heat pipe, steam channels are formed on left and right sides inside the heat pipe across the semielliptical porous sintered metals.

9. The heat transfer device according to claim 1, wherein an end side the heat pipe that is opposite the one end side of the heat pipe is pressed and flattened to be thinner than the one end side of the heat pipe.