Metal wire grid polarization plate and manufacturing method thereof, display panel and display device

• US 10,459,137 B2
• Filed: 08/23/2016
• Issued: 10/29/2019
• Est. Priority Date: 01/15/2016
• Status: Active Grant

• Current Assignee: BOE Technology Group Co., Ltd.
• Original Assignee: BOE Technology Group Co., Ltd.
• Inventors: Zhu, Ming, Yang, Yafeng, Liu, Zhen, Yao, Jikai
• Primary Examiner(s): Glick, Edward J
• Assistant Examiner(s): Chung, David Y
• Application Number:
  US15/244,375
• Publication Number:
  US 20170205550A1
• Time in Patent Office: 1,162 Days
• Field of Search: None
• CPC Class Codes: G02B 5/003 Light absorbing elements
• CPC Class Codes: G02B 5/3058 comprising electrically conductive elements, e.g. wire grids, conductive particles
• CPC Class Codes: G02F 1/133528 Polarisers
• CPC Class Codes: G02F 1/133548 Wire-grid polarisers

Abstract

A metal wire grid polarization plate and a manufacturing method thereof, a display panel and a display device are provided. The metal wire grid polarization plate includes a substrate, a light absorption wire grid and a metal wire grid. The light absorption wire grid is disposed on a side of the substrate, and the metal wire grid covers the light absorption wire grid.

Claims

1. A manufacturing method of a metal wire grid polarization plate, comprising:

forming a light absorption layer on a side of a substrate;

forming a metal layer on the light absorption layer; and

patterning the metal layer and the light absorption layer to form a metal wire grid and a light absorption wire grid, wherein

the metal wire grid is formed of a first metal, the light absorption wire grid is formed of an oxide of a second metal, and the second metal is different from the first metal, wherein

the forming the light absorption layer on the side of the substrate comprises;

depositing copper or chromium on the substrate;

oxidizing the copper or the chromium by using oxygen plasma to form the light absorption layer; and

the patterning the metal layer and the light absorption layer to form the metal wire grid and the light absorption wire grid comprises;

forming a photoresist on the metal layer;

patterning the photoresist to form a photoresist wire grid;

etching the metal layer and the light absorption layer not covered by the photoresist wire grid to form the metal wire grid and the light absorption wire grid; and

stripping off the photoresist wire grid to form the metal wire grid polarization plate.

2. The manufacturing method of the metal wire grid polarization plate according to claim 1, wherein depositing the copper or the chromium on the substrate comprises:

depositing the copper or the chromium on the substrate through a magnetron sputtering method.

3. The manufacturing method of the metal wire grid polarization plate according to claim 1, wherein the patterning the photoresist to form the photoresist wire grid comprises:

patterning the photoresist by a nano imprinting method to form the photoresist wire grid.

4. The manufacturing method of the metal wire grid polarization plate according to claim 1, wherein the etching the metal layer and the light absorption layer not covered by the photoresist wire grid comprises:

employing the photoresist wire grid as a mask to etch the metal layer and the light absorption layer which are not covered by the photoresist wire grid by using an electron beam.

5. The manufacturing method of the metal wire grid polarization plate according to claim 1, wherein the metal wire grid is made of aluminum, silver, platinum, gold or a metal compound.